IP Library Granted Patent US 8,151,234
Granted Patent B2
US 8,151,234 · App. 12/306,340 · Granted Apr 3, 2012

Method for optimizing an integrated circuit physical layout

Assignee: Takumi Technology Corporation
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Quick Facts
Patent No.
US 8,151,234
App. No.
12/306,340
Granted
Apr 3, 2012
Kind
B2
Abstract

The invention relates to a method of optimizing an integrated circuit layout, wherein an initial integrated circuit layout is provided. A predetermined set of physical characteristics of a predetermined set of polygons of said initial circuit layout, is assessed and said physical characteristics are aggregated to derive an integral quality number associated to said initial circuit layout. According to the invention, cost functions are generated to evaluate a perturbed quality number of said perturbed layout and layout perturbations are selected that optimize the quality number, so that the circuit layout is optimized.

Claims (28)

1. A computer-implemented method of creating a global integrated circuit layout comprised of a number of polygons having a predetermined geometrical relation relative to each other, comprising:

providing, by computer processor, an initial global integrated circuit layout wherein the global integrated circuit layout is provided by storing corner and edge coordinates of polygons representing the shapes of a local pattern;

assessing local quality numbers, each as a function of the corner and edge coordinates of a local pattern of polygon shapes in said initial global integrated circuit layout;

aggregating approximated functions of said local quality numbers, to derive an integral quality number associated to said initial global integrated circuit layout, wherein said approximated function is provided as linearly dependent on said corner and edge coordinates;

perturbing said integral quality number by varying said corner and edge coordinates of said polygons in a global integrated circuit layout; and

selecting perturbations of said corner and edge coordinates of said polygon shapes that improve the integral quality number, so as to optimize said global integrated circuit layout.

2. A method according to claim 1 , wherein said integral quality number represents a printing related predicted yield; a random defect related predicted yield; a predicted electrical circuit performance value; a mask making related cost; a random defect sensitivity, a quality of vias connecting multiple conducting layers in the design, a quality of electrical devices in the circuit layout, and/or a electro-migration sensitivity.

3. A method according to claim 2 , wherein said predicted electrical circuit performance is related to circuit speed and/or power consumption.

4. A method according to claim 1 , wherein the initial global integrated circuit layout includes geometrical characteristics.

5. A method according to claim 1 , wherein said approximated functions are provided by evaluating local quality numbers on perturbations on the local pattern of shapes, so as to assess approximated function values of said local quality numbers.

6. A method according to claim 1 , wherein a linear dependency on said corner and edge coordinates is provided by determining a direction of steepest descent of a multi dimensional local quality number.

7. A method according to claim 1 , wherein said approximated function is provided as a piecewise linear function.

8. A method according to claim 1 , wherein said approximated function is provided as a quadratic function.

9. A method according to claim 1 , wherein said local quality number is expressed as a function of cover margins of a target shape, of overlapping polygons, for assessing a quality number of via connections.

10. A method according to claim 1 , wherein said local quality number is expressed as a function of cover margins of simulated contours of polygons, for assessing optical proximity effects.

11. A method according to claim 1 , wherein said local quality number is expressed as a function of simulated intensities on polygon edge positions, for assessing contrast rating.

12. A method according to claim 1 , wherein said local quality number is expressed as a function of distance and common run length between adjacent polygons, for assessing random defect sensitivity.

13. A method according to claim 1 , wherein said local quality number is expressed as a function on predicted integrated circuit transistor parameters.

14. A method according to claim 1 , wherein said global integrated circuit layout is generated deterministically by a set of parameters, and wherein said perturbations are provided by perturbation of said parameters.

15. A method according to claim 1 , wherein said global integrated circuit layout is varied by varying the local pattern of shapes or approximated functions.

16. A computer program product, comprising program code portions for performing steps of a method as claimed in claim 1 , when run on a programmable apparatus.

17. An article of manufacture with a non-transitory computer usable medium having computer readable instructions therein for providing access to resources available on that computer, the computer readable instructions comprising to cause the computer to perform the steps of a method as claimed in claim 1 .

18. A system for creating an integrated circuit layout, comprising:

an input for receiving an initial global integrated circuit layout, the input adapted to store corner and edge coordinates of polygons representing the shapes of a local pattern;

a processing circuit arranged to

assess a function of the corner and edge coordinates of said initial global integrated circuit layout, to derive an integral quality number associated to said initial circuit layout as an aggregated function of local quality numbers, each as a function of the corner and edge coordinates of a local pattern of polygon shapes wherein said approximated function is provided as linearly dependent on said corner and edge coordinates;

perturb said integral quality number by varying said corner and edge coordinates of said polygons in a global integrated circuit layout; and

select perturbations of said corner and edge coordinates of said polygon shapes that improve the integral quality number; and an output for outputting said selected perturbations.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 10, 2021
From: APPLIED MATERIALS SOUTH EAST ASIA PTE. LTD.
To: APPLIED MATERIALS, INC.
Reel/Frame 057131/0770 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 28, 2021
From: SAGANTEC ISRAEL LTD.; TAKUMI TECHNOLOGY CORPORATION
To: APPLIED MATERIALS SOUTH EAST ASIA PTE. LTD.
Reel/Frame 057010/0059 →
CHANGE OF ADDRESS OF ASSIGNEE Recorded Jun 29, 2012
From: TAKUMI TECHNOLOGY CORPORATION
To: TAKUMI TECHNOLOGY CORPORATION
Reel/Frame 028488/0088 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 6, 2009
From: BERKENS, MARTINUS MARIA; KLAVER, SIMON JOHANNES
To: TAKUMI TECHNOLOGY CORPORATION
Reel/Frame 022913/0401 →
Priority Claims (1)
EP 06076308 · Jun 27, 2006 · regional
Continuity (1)
Related Publication 20100146465A1 · Jun 10, 2010