IP Library Granted Patent US 8,161,644
Granted Patent B2
US 8,161,644 · App. 12/477,471 · Granted Apr 24, 2012

Leveling method for burying evaporating section of heat pipe into thermally conductive seat

Assignees: Golden Sun News Techniques Co., Ltd.; CPUmate Inc
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Quick Facts
Patent No.
US 8,161,644
App. No.
12/477,471
Granted
Apr 24, 2012
Kind
B2
Abstract

A leveling method for burying an evaporating section of a heat pipe into a thermally conductive seat is provided for an assembly of heat pipe and heat-conducting seat by simultaneously making the evaporating section of heat pipe partially formed into a flat surface when the evaporating section of heat pipe is being burying into the thermally conductive seat. Furthermore, in cooperation with a stamping machine, the leveling method is to make a multiple steps of press-fitting process to an evaporating section of heat pipe under a condition that there is no need to change the stamping die.

Claims (15)

1. A leveling method for burying an evaporating section of a heat pipe into a thermally conductive seat, including following steps:

a) preparing at least one heat pipe ( 1 ), a thermally conductive seat ( 2 ) to be thermally connected to the heat pipe ( 1 ), and arrange at least one groove ( 21 ) at a bottom surface ( 20 ) of the thermally conductive seat ( 2 ) for burying an evaporating section ( 10 ) reserved in the heat pipe ( 1 ) therein;

b) laying the evaporating section ( 10 ) of heat pipe ( 1 ) into the groove ( 21 ) of the thermally conductive seat ( 2 ) for being fixed in a fixture ( 3 ) together;

c) disposing the fixture ( 3 ) of step b) onto a stamping machine ( 4 ) that includes:

a platform ( 40 ), on which a plurality of machining positions ( 400 , 401 , 402 , 403 ) for sequentially positioning the fixture ( 3 ) are provided; and

a punch ( 41 ), which is arranged above the platform ( 40 ) and interspaced the platform ( 40 ) correspondingly, and which process a pressing down motion toward the platform ( 40 ), and on which a plurality of pressing dies ( 410 , 411 , 412 , 413 ) are arranged, which correspond to each machining position ( 400 , 401 , 402 , 403 ) respectively, and each under face of which is a press-fitting surface ( 410 a , 411 a , 412 a , 413 a ) formed, on which an indentation ( 410 b , 411 b , 412 b ) is formed with a depth varying from deepness to shallowness according to the sequence of each machining position ( 400 , 401 , 402 ), and a last one of which ( 413 a ) is a flat surface;

d) according to the stamping machine ( 4 ) of step c), the fixture ( 3 ) being laid onto each machining position ( 400 , 401 , 402 , 403 ) in sequence, at each machining position, making each pressing die ( 410 , 411 , 412 , 413 ) execute a pressing down motion to the evaporating section ( 10 ) of the heat pipe ( 1 ) on the fixture ( 3 ), thereby, a flat surface ( 100 ) being gradually formed on a top of the evaporating section ( 10 ).

2. The leveling method for burying an evaporating section of a heat pipe into a thermally conductive seat according to claim 1 , wherein the fixture ( 3 ) in step b) is in cooperation with a condensing section ( 11 ) of the heat pipe ( 1 ) to penetrate through a perforation ( 30 ), thereby, making the condensing section ( 11 ) penetrate through the perforation ( 30 ) and pass through a bottom part of the fixture ( 3 ) as well.

3. The leveling method for burying an evaporating section of a heat pipe into a thermally conductive seat according to claim 2 , wherein a plurality of buried via holes ( 400 b , 401 b , 402 b , 403 b ) are arranged on the machining positions ( 400 , 401 , 402 , 403 ) for the passage of the condensing section ( 11 ).

4. The leveling method for burying an evaporating section of a heat pipe into a thermally conductive seat according to claim 2 , further including a step e) that a part of the condensing section ( 11 ) of the heat pipe ( 1 ) projecting from the fixture ( 3 ) is abutted, making the heat pipe ( 1 ) and the thermally conductive seat ( 2 ) separated from the fixture ( 3 ), thus, successfully taking down a product of the heat pipe ( 1 ) and the thermally conductive seat ( 2 ).

5. The leveling method for burying an evaporating section of a heat pipe into a thermally conductive seat according to claim 1 , wherein grips ( 32 ) are laterally extended from sides of the fixture ( 3 ) of the step b) for being griped by human hands.

6. The leveling method for burying an evaporating section of a heat pipe into a thermally conductive seat according to claim 1 , wherein the plural machining positions ( 400 , 401 , 402 , 403 ) on the stamping machine ( 4 ) of the step c) are respectively designated as a first machining position ( 400 ), a second machining position ( 401 ), a third machining position ( 402 ) and a fourth machining position ( 403 ), all of which ( 400 , 401 , 402 , 403 ) are arrayed crossly over the platform ( 40 ) of the stamping machine ( 4 ).

7. The leveling method for burying an evaporating section of a heat pipe into a thermally conductive seat according to claim 6 , wherein the machining positions ( 400 , 401 , 402 , 403 ) are arranged a plurality of positioning pillars ( 400 a , 401 a , 402 a , 403 a ), which are in cooperation with the fixture ( 3 ) and are aligned to the ditches ( 31 ) arranged at external sides of the fixture ( 3 ) for positioning the fixture ( 3 ).

8. The leveling method for burying an evaporating section of a heat pipe into a thermally conductive seat according to claim 6 , wherein the plural pressing dies ( 410 , 411 , 412 , 413 ) of the stamping machine ( 4 ) in the step c) are sequentially designated as a first pressing die ( 410 ), a second pressing die ( 411 ), a third pressing die ( 412 ) and a fourth pressing die ( 413 ), which respectively correspond to the first machining position ( 400 ), the second machining position ( 401 ), the third machining position ( 402 ) and the fourth machining position ( 403 ).

9. The leveling method for burying an evaporating section of a heat pipe into a thermally conductive seat according to claim 1 , wherein a plurality of guiding rods ( 414 ) are extended downwardly from the punch ( 41 ) of the stamping machine ( 4 ) in the step c), and wherein the platform ( 40 ) are arranged a plurality of guiding holes ( 404 ), through which the guiding rods ( 414 ) maintain a predetermined depth that the punch ( 41 ) presses down.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 3, 2009
From: LIN, KUO-LEN; LIN, CHEN-HSIANG; WANG, HWAI-MING; HSU, KEN; CHENG, CHIH-HUNG
To: GOLDEN SUN NEWS TECHNIQUES CO., LTD.; CPUMATE INC
Reel/Frame 022774/0818 →
Priority Claims (1)
TW 97138229 A · Oct 3, 2008 · national
Continuity (1)
Related Publication 20100083500A1 · Apr 8, 2010