IP Library Granted Patent US 8,166,642
Granted Patent B2
US 8,166,642 · App. 12/612,817 · Granted May 1, 2012

Stripline flex circuit

Assignee: The Boeing Company
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,166,642
App. No.
12/612,817
Granted
May 1, 2012
Kind
B2
Abstract

The invention removes copper from the concave side of a flex circuit around a bendable region and replaces it with a conductive epoxy to allow it to be formed to tighter bend radii than would otherwise be possible. After the flex circuit is shaped in a tight radius and attached to a mechanical structure, the conductive epoxy is cured to act as functional replacement of the removed copper.

Claims (9)

1. A method for forming a conformable circuit element, the method comprising:

depositing a conductive layer on a first side of a flex circuit;

etching said conductive layer to form an etched region, wherein the etched region breaks electrical continuity of the conductive layer;

depositing a conductive epoxy on the etched region, wherein the conductive epoxy restores the electrical continuity of the conductive layer;

bending the flex circuit in the etched region to form a concave surface on the first side; and

curing the conductive epoxy.

2. The method of claim 1 , wherein curing the conductive epoxy comprises curing the conductive epoxy until the conductive epoxy becomes structural and conductive.

3. The method of claim 1 , wherein the conductive epoxy is cured into a B-stage state prior to bending the flex circuit.

4. The method of claim 1 , wherein the size of the etched region is determined as a function of a bending radius.

Continuity (2)
Division 11558615 · Nov 10, 2006
Related Publication 20100043223A1 · Feb 25, 2010