Method of manufacturing semiconductor device and substrate processing apparatus
View Patent ↗There are provided a method of manufacturing a semiconductor device and a substrate processing apparatus by which the quality of a silicon nitride film can be improved. The method comprises: (a) supplying a silicon-containing gas into a process chamber accommodating a substrate in a heated state; (b) switching between an exhaust stop state and an exhaust operation state at least two times while a nitrogen-containing gas is supplied into the process chamber so as to vary an inside pressure of the process chamber such that a maximum inside pressure of the process chamber is at least twenty times higher than a minimum inside pressure of the process chamber. The steps (a) and (b) are alternately repeated to form a silicon nitride film on the substrate.
1. A method of forming a silicon nitride film on a substrate, the method comprising:
supplying a silicon-containing gas into a process chamber accommodating the substrate in a heated state by opening a first valve;
evacuating the process chamber by closing the first valve and opening an exhaust valve;
supplying a nitrogen-containing gas into the process chamber by opening a second valve while switching between an exhaust stop state and an exhaust operation state at least two times by repeatedly opening and closing the exhaust valve with the second valve open thereby varying an inside pressure of the process chamber such that a maximum inside pressure of the process chamber is at least twenty times higher than a minimum inside pressure of the process chamber; and
evacuating the process chamber by closing the second valve and opening the exhaust valve.
2. A substrate processing apparatus comprising:
a process chamber configured to process a substrate;
a first gas supply unit configured to supply a silicon-containing gas into the process chamber by opening a first valve;
a second gas supply unit configured to supply a nitrogen-containing gas into the process chamber by opening a second valve;
a heater configured to heat the substrate in the process chamber;
an exhaust unit configured to evacuate the process chamber by opening an exhaust valve; and
a controller configured to control the exhaust unit, the first gas supply unit, the second gas supply unit and the heater,
wherein the controller controls the first valve and the second valve such that the silicon-containing gas and the nitrogen-containing gas are alternately supplied into the process chamber to form a silicon nitride film on the substrate, and
wherein the controller causes the exhaust unit to switch between an exhaust stop state and an exhaust operation state at least two times by repeatedly opening and closing the exhaust valve while maintaining the second valve open to supply the nitrogen-containing gas into the process chamber thereby varying an inside pressure of the process chamber such that a maximum inside pressure of the process chamber is at least twenty times higher than a minimum inside pressure of the process chamber.