Method for perforating heat meltable material
The present invention relates to a method for making holes in a layer ( 1 ) of heat-fusible material. According to the invention a layer of absorbent material ( 2 ) is placed in contact with a layer ( 1 ) of heat-fusible material, following which the layer of heat-fusible material is heated locally so that holes are formed in the material.
1. A method for making holes in a layer of heat-fusible material, characterized in that a layer of absorbent material is brought together with the layer of heat-fusible material, following which the layers brought together are fed through a device for localized heating of the heat-fusible material, so that the heat-fusible material melts, forming holes in the heat-fusible material material, wherein the molten heat-fusible material is absorbed into the absorbent material, and the layer of absorbent material is removed from the layer of heat-fusible material after having absorbed molten heat-fusible material from the holes made in the layer of heat-fusible material.
2. The method of claim 1 , characterized in that the heating is done by means of an ultrasonic device.
3. The method of claim 1 , characterized in that before localized heating of the heat-fusible material, one or more layers of material are applied to the layer of heat-fusible material on an opposite side to the side in contact with the absorbent layer.
4. The method of claim 2 , characterized in that before localized heating of the heat-fusible material, one or more layers of material are applied to the layer of heat-fusible material on an opposite side to the side in contact with the absorbent layer.
5. A method for making holes in a layer of heat-fusible material, the method comprising:
a) bringing together a layer of absorbent material with the layer of heat-fusible material,
b) feeding the brought-together layers of absorbent and heat-fusible material through a device for localized heating of the heat-fusible material, and heating locally such that the heat-fusible material melts, thereby forming holes in the heat-fusible material, wherein the melted heat-fusible material is absorbed into the absorbent material, and then
c) removing the layer of absorbent material containing the melted heat-fusible material from the layer of heat-fusible material.
6. The method of claim 5 , wherein heating is performed by an ultrasonic device.
7. The method of claim 5 , wherein prior to heating, one or more layers of material are applied to the layer of heat-fusible material on an opposite side to the side in contact with the absorbent layer.
8. The method of claim 6 , wherein prior to heating, one or more layers of material are applied to the layer of heat-fusible material on an opposite side to the side in contact with the absorbent layer.