Light emitting diode package structure
A light-emitting diode (LED) package structure including a carrier substrate, at least one LED chip, an optical element and a highly thermal-conductive transparent liquid is provided. The LED chip is disposed on the carrier substrate and has an active layer. The optical element is disposed on the substrate and forms a sealed space with the carrier substrate, and the LED chip is disposed in the sealed space. The highly thermal-conductive transparent liquid fills up the sealed space.
1. A light emitting diode (LED) package structure, comprising:
a carrier substrate;
at least one LED chip, disposed on the carrier substrate and having an active layer;
an insulating layer covering the active layer, a plurality of pads of the at least LED chip and a plurality of conductive lines respectively electrically connected to the plurality of the pads;
an optical element, disposed on the substrate and forming a sealed space with the carrier substrate, wherein the LED chip is disposed in the sealed space; and
a highly thermal-conductive transparent liquid, filling up the sealed space.
2. The LED package structure of claim 1 , further comprising a sealing member disposed outside the sealed space, wherein the sealing member connects the carrier substrate and an outer periphery of the optical element.
3. The LED package structure of claim 2 , further comprising a fixed component disposed on the carrier substrate, wherein the fixed component connects the sealing member and the carrier substrate.
4. The LED package structure of claim 2 , further comprising a connection layer disposed between the sealing member and the carrier substrate, and a material of the connection layer comprises a metal or an alloy.
5. The LED package structure of claim 1 , wherein the highly thermal-conductive transparent liquid comprises at least one antifreeze material.
6. The LED package structure of claim 1 , wherein the highly thermal-conductive transparent liquid contains a plurality of suspended particles.
7. The LED package structure of claim 1 , wherein the highly thermal-conductive transparent liquid is an electric insulated liquid.
8. The LED package structure of claim 1 , wherein a thermal conductivity of the highly thermal-conductive transparent liquid is greater than a thermal conductivity of epoxy resin.
9. The LED package structure of claim 1 , further comprising a light conversion layer disposed on a light-emitting path of the LED chip.
10. The LED package structure of claim 1 , wherein the insulating layer comprises a light conversion layer directly attached to the LED chip.
11. A light emitting diode (LED) package structure, comprising:
a carrier substrate;
at least one LED chip, disposed on the carrier substrate and having an active layer;
an optical element, disposed on the substrate and forming a sealed space with the carrier substrate, wherein the LED chip is disposed in the sealed space;
a highly thermal-conductive transparent liquid, filling up the sealed space;
a fixed component disposed directly on the carrier substrate; and
a sealing member disposed outside the sealed space and on the fixed component, wherein the sealing member, without directly contacting with the carrier substrate, connects the carrier substrate and an outer periphery of the optical element through the fixed component in-between.
12. The LED package structure of claim 11 , wherein the highly thermal-conductive transparent liquid comprises at least one antifreeze material.
13. The LED package structure of claim 11 , wherein the highly thermal-conductive transparent liquid contains a plurality of suspended particles.
14. The LED package structure of claim 11 , wherein the highly thermal-conductive transparent liquid is an electric insulated liquid.
15. The LED package structure of claim 11 , wherein a thermal conductivity of the highly thermal-conductive transparent liquid is greater than a thermal conductivity of epoxy resin.
16. The LED package structure of claim 11 , further comprising a light conversion layer disposed on a light-emitting path of the LED chip.
17. A light emitting diode (LED) package structure, comprising:
a carrier substrate;
at least one LED chip, disposed on the carrier substrate and having an active layer;
an optical element, disposed on the substrate and forming a sealed space with the carrier substrate, wherein the LED chip is disposed in the sealed space;
a highly thermal-conductive transparent liquid, filling up the sealed space;
a connection layer disposed directly on the carrier substrate, wherein a material of the connection layer comprises a metal or an alloy; and
a sealing member disposed outside the sealed space and on the connection layer, wherein the sealing member, without directly contacting with the carrier substrate, connects the carrier substrate and an outer periphery of the optical element through the connection layer in-between.
18. The LED package structure of claim 17 , wherein the highly thermal-conductive transparent liquid comprises at least one antifreeze material.
19. The LED package structure of claim 17 , wherein the highly thermal-conductive transparent liquid contains a plurality of suspended particles.
20. The LED package structure of claim 17 , wherein the highly thermal-conductive transparent liquid is an electric insulated liquid.
21. The LED package structure of claim 17 , wherein a thermal conductivity of the highly thermal-conductive transparent liquid is greater than a thermal conductivity of epoxy resin.
22. The LED package structure of claim 17 , further comprising a light conversion layer disposed on a light-emitting path of the LED chip.