Methods of forming recessed gate structures including blocking members, and methods of forming semiconductor devices having the recessed gate structures
A recessed gate structure in a semiconductor device includes a gate electrode partially buried in a substrate, a blocking member formed in the buried portion of the gate electrode, and a gate insulation layer formed between the gate electrode and the substrate. The blocking member may effectively prevent a void or a seam in the buried portion of the gate electrode from contacting the gate insulation layer adjacent to a channel region in subsequent manufacturing processes. Thus, the semiconductor device may have a regular threshold voltage and a leakage current passing through the void or the seam may efficiently decrease.
1. A method of forming a recessed gate structure, comprising:
forming a recess structure having an enlarged lower portion in a substrate;
forming a gate insulation layer on surfaces of the recess structure and the substrate;
forming a gate electrode partially buried in the recess structure on the gate insulation layer, comprising forming a first conductive layer pattern on the gate insulation layer to partially fill up the recess structure;
forming a blocking member on the first conductive layer pattern;
forming a second conductive layer pattern on the blocking member to fill up the recess structure; and
forming a third conductive layer pattern on the first conductive layer pattern, the second conductive layer pattern and the blocking member.
2. The method of claim 1 , wherein forming the recess structure comprises:
forming a first mask on the substrate;
forming a first recess from the surface of the substrate by etching the substrate using the first mask;
forming a second mask on a sidewall of the first recess; and
forming a second recess beneath the first recess by etching the substrate using the second mask.
3. The method of claim 1 , wherein the blocking member is formed by an oxidization or a silicidation of a surface of the first conductive layer.
4. The method of claim 1 , wherein forming the first conductive layer pattern and forming the blocking member comprise:
forming a first conductive layer on the gate insulation layer;
forming a preliminary blocking member on the first conductive layer; and
forming the first conductive layer pattern and the blocking member by partially removing the first conductive layer and the preliminary blocking member.
5. The method of claim 4 , wherein the preliminary blocking member is partially removed using an etching solution including fluorine or an etching gas including fluorine, and the first conductive layer is partially removed by an etch-back process.
6. The method of claim 1 , wherein
the second conductive layer pattern is formed on the blocking member so as to protrude from the substrate.
7. A method of manufacturing a semiconductor device, comprising:
forming an isolation layer on a substrate to define an active region;
forming a recess structure having an enlarged lower portion in the active region;
forming a gate insulation layer from a surface of the recess structure onto the active region;
forming a gate electrode partially buried in the recess structure on the gate insulation layer, comprising forming a first conductive layer pattern on the gate insulation layer to partially fill up the recess structure;
forming a blocking member on the first conductive layer pattern;
forming a second conductive layer pattern on the blocking member to fill up the recess structure;
forming a third conductive layer pattern on the first conductive layer pattern, the second conductive layer pattern and the blocking member; and
forming source/drain regions at portions of the substrate adjacent to the gate electrode.
8. The method of claim 7 , wherein the blocking member is formed by an oxidization and a silicidation of a surface of the first conductive layer.
9. The method of claim 7 , wherein forming the first conductive layer pattern and forming the blocking member comprise:
forming a first conductive layer on the gate insulation layer;
forming a preliminary blocking member on the first conductive layer; and
forming the first conductive layer pattern and the blocking member by partially removing the first conductive layer and the preliminary blocking member.
10. The method of claim 7 , wherein
the second conductive layer pattern is formed on the blocking member so as to protrude from the substrate.