Memory module, memory system, and information device
A memory system including ROM and RAM in which reading and writing are enabled. A memory system includes a non-volatile memory (FLASH), DRAM, a control circuit, and an information processing device. Data in FLASH is transferred to SRAM or DRAM in advance. Data transfer between the non-volatile memory and the DRAM can be performed in the background. The memory system including these plural chips is configured as a memory system module in which each chip is mutually laminated and each chip is wired via a ball grid array (BGA) and bonding wire between the chips. Data in FLASH can be read at the similar speed to that of DRAM by securing a region in which the data in FLASH can be copied in DRAM and transferring the data to DRAM in advance immediately after power is turned on or by a load instruction.
1. A memory system including a memory module having a non-volatile memory, a dynamic random access memory, a static random access memory, and a first control circuit that accesses the non-volatile memory, the dynamic random access memory, and the static random access memory, comprising:
a dynamic random access memory interface for accessing, from a device outside the memory module, the dynamic random access memory and the static random access memory,
wherein the dynamic random access memory includes plural interfaces for accessing plural memories.
2. The memory system according to claim 1 , wherein the plural interfaces are for accessing at least two types of different memories.
3. The memory system according to claim 2 , wherein, immediately after power is turned on, data in a predetermined address region of the non-volatile memory is transferred to the static random access memory.
4. The memory system according to claim 2 , wherein, immediately after power is turned on, data in a predetermined address region of the non-volatile memory is transferred to the dynamic random access memory.
5. The memory system according to claim 4 , wherein data transfer range data, which includes a range of a predetermined address region of the non-volatile memory, is held in the non-volatile memory.
6. The memory system according to claim 2 , wherein data transfer between the non-volatile memory and the dynamic random access memory or the static random access memory is performed based on an instruction sent via the dynamic random access memory interface.
7. The memory system according to claim 2 , wherein, in transferring data from the non-volatile memory to the static random access memory or the dynamic random access memory, data acquired by correcting an error is transferred.
8. The memory system according to claim 2 , wherein, in transferring data from the static random access memory or the dynamic random access memory to the non-volatile memory, an address replacement process is executed.
9. The memory system according to claim 2 , wherein a boot program is held in the non-volatile memory.
10. The memory system according to claim 2 , wherein data transfer range data, which includes a range of data transferred from the non-volatile memory to the dynamic random access memory at initial time when operating power is turned on, is held in the non-volatile memory.
11. The memory system according to claim 2 ,
wherein the non-volatile memory and the dynamic random access memory are similar in memory size, and
wherein the static random access memory has a memory size equal to or smaller than 1/1000 of the memory size of the non-volatile memory.
12. The memory system according to claim 2 , wherein a data-hold operation of the dynamic random access memory is executed inside the memory module.
13. The memory system according to claim 12 , wherein, when the data-hold operation is provided to the dynamic random access memory from the device, the data-hold operation of the dynamic random access memory inside the memory module is stopped.
14. The memory system according to claim 2 , wherein:
the device accesses the memory module first;
the dynamic random access memory performs a data-hold operation second; and
the memory module performs data transfer between the non-volatile memory and the static random access memory or the dynamic random access memory third.
15. The memory system according to claim 2 ,
wherein the dynamic random access memory is synchronous, and
wherein access to the non-volatile memory and the dynamic random access memory from the device is made via the dynamic random memory access interface.
16. The memory system according to claim 2 ,
wherein the non-volatile memory is a NAND flash memory, and
wherein the dynamic random access memory is synchronous.
17. The memory system according to claim 2 ,
wherein the non-volatile memory is an AND flash memory, and
wherein the dynamic random access memory is synchronous.
18. The memory system according to claim 2 , wherein the non-volatile memory performs error detection, error correction, and address replacement.
19. The memory system according to claim 18 , wherein a memory array of the non-volatile memory is configured according to NAND configuration.
20. The memory system according to claim 18 , wherein a memory array of the non-volatile memory is configured according to AND configuration.
21. The memory system according to claim 2 , wherein the dynamic random access memory includes a second control circuit which processes access from the device and a third control circuit that independently accesses the non-volatile memory.
22. The memory system according to claim 2 , wherein the dynamic random access memory includes a second control circuit that independently accesses the non-volatile memory and a circuit to subordinately process access to the non-volatile memory by the second control circuit.
23. The memory system according to claim 1 , wherein the plural interfaces are for accessing the dynamic random access memory and the non-volatile memory.
24. The memory system according to claim 23 , wherein, immediately after power is turned on, data in a predetermined address region of the non-volatile memory is transferred to the static random access memory.
25. The memory system according to claim 23 , wherein, immediately after power is turned on, data in a predetermined address region of the non-volatile memory is transferred to the dynamic random access memory.
26. The memory system according to claim 25 , wherein data transfer range data, which includes a range of a predetermined address region of the non-volatile memory, is held in the non-volatile memory.
27. The memory system according to claim 25 , wherein a data-hold operation of the dynamic random access memory is executed inside the memory module.
28. The memory system according to claim 27 , wherein, when the data-hold operation is provided to the dynamic random access memory from the device, the data-hold operation of the dynamic random access memory inside the memory module is stopped.
29. The memory system according to claim 23 , wherein data transfer between the non-volatile memory and the dynamic random access memory or the static random access memory is performed based on an instruction sent via the dynamic random access memory interface.
30. The memory system according to claim 23 , wherein, in transferring data from the non-volatile memory to the static random access memory or the dynamic random access memory, data acquired by correcting an error is transferred.
31. The memory system according to claim 23 , wherein, in transferring data from the static random access memory or the dynamic random access memory to the non-volatile memory, an address replacement process is executed.
32. The memory system according to claim 23 , wherein a boot program is held in the non-volatile memory.
33. The memory system according to claim 23 , wherein data transfer range data, which includes a range of data transferred from the non-volatile memory to the dynamic random access memory at initial time when operating power is turned on, is held in the non-volatile memory.
34. The memory system according to claim 23 ,
wherein the non-volatile memory and the dynamic random access memory are similar in memory size, and
wherein the static random access memory has a memory size equal to or smaller than 1/1000 of the memory size of the non-volatile memory.
35. The memory system according to claim 23 , wherein:
the device accesses the memory module first;
the dynamic random access memory performs a data-hold operation second; and
the memory module performs data transfer between the non-volatile memory and the static random access memory or the dynamic random access memory third.
36. The memory system according to claim 23 ,
wherein the dynamic random access memory is synchronous, and
wherein access to the non-volatile memory and the dynamic random access memory from the device is made via the dynamic random memory access interface.
37. The memory system according to claim 23 ,
wherein the non-volatile memory is a NAND flash memory, and
wherein the dynamic random access memory is synchronous.
38. The memory system according to claim 23 ,
wherein the non-volatile memory is an NAND flash memory, and
wherein the dynamic random access memory is synchronous.
39. The memory system according to claim 23 , wherein the non-volatile memory performs error detection, error correction, and address replacement.
40. The memory system according to claim 39 , wherein a memory array of the non-volatile memory is configured according to NAND configuration.
41. The memory system according to claim 39 , wherein a memory array of the non-volatile memory is configured according to AND configuration.
42. The memory system according to claim 23 , wherein the dynamic random access memory includes a second control circuit which processes access from the device and a third control circuit that independently accesses the non-volatile memory.
43. The memory system according to claim 23 , wherein the dynamic random access memory includes a second control circuit that independently accesses the non-volatile memory and a circuit to subordinately process access to the non-volatile memory by the second control circuit.