Semiconductor package having ink-jet type dam and method of manufacturing the same

1. A method of manufacturing a semiconductor package, the method comprising:

manufacturing a substrate that comprises a chip mounting unit and a pad forming unit disposed on an outer region of the chip mounting unit and a plurality of pads disposed on the pad forming unit;

mounting a semiconductor chip on the chip mounting unit of the substrate;

forming a dam on at least a part of the substrate between the semiconductor chip and the pad forming unit, wherein the forming of the dam includes marking letters on a top surface of the semiconductor chip, and wherein the dam and the letters are formed of the same material, and wherein an upper surface of the dam is rounded due to surface tension by using an inkjet process; and

filling an underfill material between the semiconductor chip and the substrate.

2. The method of claim 1 , further comprising: hardening the dam after forming the dam by using the inkjet process.

3. The method of claim 1 , wherein the dam surrounds the semiconductor chip.

4. The method of claim 3 , wherein the dam has a wound shape.

5. The method of claim 1 , wherein the dam surrounds the semiconductor chip as multi-walls.

6. The method of claim 1 , wherein the dam comprises at least one of a bar pattern corresponding to a side of the semiconductor chip or a corrugate pattern corresponding to at least a portion of the pads.

7. The method of claim 1 , wherein the dam comprises ring shape patterns that surround at least portions of the pads, respectively.

8. The method of claim 1 , wherein a distance between the semiconductor chip and the dam is 20 to 50 μm, a distance between the dam and the pads is 10 to 50 μm, and a distance between the semiconductor chip and the pads is 80 μm.

9. The method of claim 1 , wherein the substrate comprises windows arranged on the chip mounting unit,

wherein pads of the semiconductor chip are exposed through the windows,

wherein the dam is disposed on a lower surface of the substrate of circumferences of the windows, and

wherein the underfill material is formed to fill in the windows and the dam.

10. The method of claim 1 , wherein the mounting of the semiconductor chip comprises: mounting two semiconductor chips.

11. The method of claim 10 , wherein the two semiconductor chips are mounted in a stack type structure in which a lower semiconductor chip is mounted on the substrate through wire bonding, and an upper semiconductor chip is stacked on the lower semiconductor chip through flip chip bonding,

wherein the underfill material is disposed between the upper semiconductor chip and the lower semiconductor chip, and

wherein the dam is formed on the lower semiconductor chip to surround a portion of the lower semiconductor where the underfill material is disposed.

12. The method of claim 10 , wherein the two semiconductor chips are mounted in a stack type structure in which a lower semiconductor chip is mounted on the substrate through flip chip bonding, and an upper semiconductor chip is stacked on the lower semiconductor chip through wire bonding,

wherein the underfill material is disposed between the lower semiconductor chip and the substrate, and

wherein the dam is formed on the substrate to surround a portion of the substrate where the underfill material is disposed.

13. The method of claim 10 , wherein the two semiconductor chips are mounted on the substrate in which one of the two semiconductor chips is mounted on the substrate through flip chip bonding,

wherein the underfill material is disposed between the semiconductor chip mounted on the substrate through flip chip bonding and the substrate, and

wherein the dam is formed between the two semiconductor chips.

14. The method of claim 1 , wherein the dam comprises an ink composite that comprises a (meta) acryl group monomer, a (meta) acryl group oligomer, a photo-initiator, a dye, and an additive.