High dielectric constant ceramic-polymer composites, embedded capacitors using the same, and fabrication method thereof
View Patent ↗Disclosed are ceramic-polymer composite consisting of aggregates of dielectric ceramic particles and polymer resin, and a fabrication method thereof, the method including aggregating dielectric ceramic particles to create aggregates, melting polymer resin in a solvent to prepare a polymer solution, dispersing the aggregates in the polymer solution to prepare a mixed solution, and hardening the mixed solution to obtain ceramic-polymer composites.
1. A method for fabricating ceramic-polymer composites comprising:
aggregating dielectric ceramic particles to create aggregates;
melting polymer resin in a solvent to prepare a polymer solution;
dispersing the aggregates in the polymer solution to prepare a mixed solution; and
hardening the mixed solution to obtain ceramic-polymer composites.
2. The method of claim 1 , wherein the dielectric ceramic particle is a ferroelectric particle, a paraelectric particle or a compound thereof.
3. The method of claim 1 , wherein the dielectric ceramic particle is BaTiO 3 , (Ba,Ca)TiO 3 , (Ba,Sr)TiO 3 , PbTiO 3 , (Pb,Zr)TiO 3 , Pb(Mn,Nb)O 3 , Pb(Mn,Nb)O 3 —PbTiO 3 , SrTiO 3 , Ta 2 O 3 , TiO 2 , Al 2 O 3 or SiO 2 .
4. The method of claim 1 , wherein the polymer resin is one of a thermoplastic resin selected from a group consisting of polyethylene, polyamide, polyphenylene ether, polysulfone, polystyrene and liquid crystal polymer, a thermosetting resin selected from a group consisting of epoxy resin, polyimide, phenolic resin, BT resin, cyanate ether and benzocyclobutene, or a compound thereof.
5. The method of claim 1 , wherein the ceramic-polymer composite consists of 10-60% by weight of aggregates of dielectric ceramic particles and 40-90% by weight of polymer resin.
6. The method of claim 1 , wherein the size of each dielectric ceramic particle is in the range of 20 nm to 500 nm.
7. The method of claim 1 , wherein the size of the aggregate is more than 1 μm, and less than a thickness of the ceramic-polymer composite.
8. The method of claim 1 , wherein the size of the aggregate is in the range of 1 μm to 15 μm.
9. The method of claim 1 , wherein the aggregation is spontaneously achieved between particles.
10. The method of claim 1 , wherein the aggregation is achieved by thermal treatment.
11. The method of claim 10 , wherein the size of the dielectric ceramic particle is in the range of 20-100 nm, and a thermal treatment temperature is in the range of 600-1100° C.
12. The method of claim 10 , wherein the size of the dielectric ceramic particle is in the range of 100-300 nm and a thermal treatment temperature is in the range of 800-1200° C.
13. The method of claim 10 , wherein the size of the dielectric ceramic particle is in the range of 300-500 nm and a thermal treatment temperature is in the range of 900-1300° C.