Etching and hole arrays
Lithographic and nanolithographic methods that involve patterning a first compound on a substrate surface, exposing non-patterned areas of the substrate surface to a second compound and removing the first compound while leaving the second compound intact. The resulting hole patterns can be used as templates for either chemical etching of the patterned area of the substrate or metal deposition on the patterned area of the substrate.
1. A method comprising
providing a tip with at least a first compound disposed thereon and a substrate;
transferring the first compound from the tip to a surface of the substrate to produce a patterned area;
after the patterned area is formed, depositing a second compound on a non-patterned area of the surface by exposing the substrate to the second compound;
selectively removing the first compound from the patterned area of the surface so that the second compound on the non-patterned area of the surface remains deposited on the non-patterned area; and
then etching the patterned area of the surface.
2. The method of claim 1 , wherein the surface of the substrate is a metal surface.
3. The method of claim 1 , wherein the substrate comprises a semiconductor.
4. The method of claim 1 , wherein the substrate comprises a transparent material.
5. The method of claim 1 , wherein the tip is a scanning probe microscope tip.
6. The method of claim 1 , wherein the tip is an atomic force microscope tip.
7. The method of claim 1 , wherein the tip is a hollow tip.
8. The method of claim 1 , wherein the tip is a non-hollow tip.
9. The method of claim 1 , wherein the first compound is chemisorbed to the surface.
10. The method of claim 1 , wherein the first compound is a sulfur-containing compound.
11. The method of claim 1 , wherein the first compound forms a self-assembled monolayer on the patterned area of the surface.
12. The method of claim 1 , wherein the second compound is chemisorbed on the surface.
13. The method of claim 1 , wherein the second compound is a sulfur-containing compound.
14. The method of claim 1 , wherein the depositing the second compound results in forming of a self-assembled monolayer.
15. The method of claim 1 , wherein the depositing the second compound comprises immersing the substrate in a solution comprising the second compound.
16. The method of claim 1 , wherein a desorption potential of the second compound is higher than a desorption potential of the first compound.
17. The method of claim 1 , wherein the removing comprises desorbing the first compound from the patterned area of the surface.
18. The method of claim 17 , wherein said desorbing is performed electrochemically.
19. The method of claim 1 , wherein the first compound is 16-mercaptohexadecanoic acid (MHA) and the second compound 1-octadecanethiol.
20. The method of claim 1 , wherein the patterned area forms an array.
21. The method of claim 1 , wherein the patterned area comprises lines or dots.
22. The method of claim 1 , wherein the patterned area after etching is characterized by gap features with lateral dimensions of about 500 nm or less.
23. The method of claim 1 , wherein the patterned area after etching is characterized by gap features with lateral dimensions of about 200 nm or less.
24. The method of claim 1 , wherein the patterned area after etching is characterized by gap features with lateral dimensions of about 100 nm or less.
25. A method comprising providing a nanoscopic tip and a solid substrate;
disposing a composition comprising a first compound on the tip; depositing the first compound from the tip to a surface of the substrate to produce a patterned area, wherein the first compound forms a self-assembled monolayer on the surface; depositing a second compound on a non-patterned area of the surface by exposing the substrate to the second compound, wherein the second compound forms a self-assembled monolayer on the surface;
selectively electrochemically removing the first compound from the patterned area of the surface so that the second compound on the non-patterned area of the surface remains deposited on the non-patterned area; and etching the patterned area of the surface.
26. A method comprising
providing a tip and a substrate;
applying a first compound from the tip to a surface of the substrate to produce a patterned area;
depositing a second compound on a non-patterned area of the surface by exposing the substrate to the second compound;
selectively removing the first compound from the patterned area of the surface so that the second compound on the non-patterned area of the surface remains deposited on the non-patterned area, wherein the removing comprises electrochemically desorbing the first compound from the patterned area of the surface; and
then etching the patterned area of the surface.