Multilayer metamaterial isolator
A method of fabricating an array of radiating elements includes on one layer or surface of a dielectric substrate, forming a first leg of a first resonator loop, on another layer or surface of the dielectric substrate forming a second leg of the first resonator loop between adjacent radiating elements, forming a via through the dielectric substrate, and metallizing the via forming a third leg of the first resonator loop interconnecting the first and second legs.
1. A method of fabricating an array of radiating elements, the method comprising:
on one layer or surface of a dielectric substrate, forming a first leg of a first resonator loop;
on another layer or surface of the dielectric substrate forming a second leg of the first resonator loop between adjacent radiating elements;
forming a via through the dielectric substrate; and
metallizing the via forming a third leg of the first resonator loop interconnecting the first and second legs,
fabricating a second resonator loop by:
forming a first leg adjacent the first leg of the first resonator loop,
forming a second leg adjacent the second leg of the first resonator loop, and
forming a third leg extending through the dielectric substrate interconnecting the first and second legs of the second resonator loop.
2. The method of claim 1 in which the adjacent radiating elements are formed on the same layer as the second leg.
3. The method of claim 1 further including forming interdigitated spaced fingers of the first and second resonator loops.
4. The method of claim 1 in which the first resonator loop constitutes a unit cell, the method further including forming a strip of adjacent unit cells.
5. A method to fabricate a multilayer metamaterial isolator, the method comprising:
on one layer or surface of a multilayer dielectric substrate, forming a first leg of a first resonator loop;
on another layer or surface of the multilayer dielectric substrate forming a second leg of the first resonator loop between adjacent radiating elements;
forming a via through the dielectric substrate; and
metallizing the via forming a third leg of the first resonator loop interconnecting the first and second legs.
6. The method of claim 5 in which the adjacent radiating elements are formed on the same layer as the second leg.
7. The method of claim 5 , further comprising:
fabricating a second resonator loop by:
forming a first leg adjacent the first leg of the first resonator loop,
forming a second leg adjacent the second leg of the first resonator loop, and
forming a third leg extending through the dielectric substrate interconnecting the first and second legs of the second resonator loop.
8. The method of claim 7 further including forming interdigitated spaced fingers of the first and second resonator loops.
9. The method of claim 5 in which the first resonator loop constitutes a unit cell, the method further including forming a strip of adjacent unit cells.