Electronic package with stacked modules with channels passing through metal layers of the modules
View Patent ↗One aspect of the present invention provides an electronic package, comprising at least a first module and a second module arranged on top of the first module, the modules together in the form of a module stack, wherein the first and second modules are adhesively connected together, each module includes a substrate layer having at least one metal layer, at least one die and a plastic(s) package molding compound layer molded over said die or dice, in each module the die or dice are bonded on said substrate layer via the metal layer, a plurality of channels formed generally vertically acting as vias to connect the metal layers and arranged adjacent to the die or dice in at least one of the modules, some or all the channels provided with an inner surface coated with a conductive material layer or filled with a conductive material for electrical connection whereby the dice are electrically connected together, and means serving as an intermediary for providing electrical, mechanical and thermal connectivity, communication externally and connected to the channels.
1. An electronic package, comprising at least a first module and a second module arranged on top of said first module, the modules together in the form of a module stack; wherein,
said first and second modules are adhesively connected together;
at least one of said modules includes a substrate layer having at least one metal layer, at least one die and a plastic(s) package molding compound layer molded over said die or dice;
in said at least one of said modules, said die or dice are bonded on said substrate layer via said metal layer;
a plurality of channels formed generally vertically passing through the metal layer acting as vias to connect said metal layer of the at least one of said modules to the other of said modules and arranged adjacent said die or dice in said at least one of said modules or in said module stack, at least some of the channels passed through the module stack, some or all said channels provided with an inner surface coated with a conductive material layer or filled with a conductive material for electrical connection whereby said dice are electrically connected together; and
an intermediary for providing electrical, mechanical and thermal connectivity, communication externally and connected to said channels.
2. An electronic package as claimed in claim 1 , wherein said second module is provided with a lower surface connected to an upper surface of the first module, with said lower surface being substantially planar and free of recesses.
3. An electronic package as claimed in claim 1 , wherein said dice in each said module stack do not share the same profile.
4. An electronic package as claimed in claim 1 , comprising at least a logic chip and/or a memory chip.
5. An electronic package as claimed in claim 1 , wherein one or more said channels extend across a substantial height of said module stack.
6. An electronic package as claimed in claim 1 , wherein one or more said channels have a generally cylindrical, triangular prism or rectangular prism profile.
7. An electronic package as claimed in claim 1 , wherein said channels are formed by mechanical drilling or laser drilling.
8. An electronic package as claimed in claim 1 , wherein when said inner surface of said channels is coated by said conductive material layer, said conductive material layer is coated on said inner surface of said channels by a single step of electroplating.
9. An electronic package as claimed in claim 1 , wherein said intermediary is a bonding pad.
10. An electronic package as claimed in claim 1 , wherein said intermediary is arranged at a bottom surface of said electronic package.
11. An electronic package assembly, comprising a plurality of electronic packages, at least one of which is an electronic package as claimed in claim 1 .