Semiconductor device and method for manufacturing same
A semiconductor device includes: a first layer; a second layer; a columnar structural unit; and a side portion. The second layer is provided on a major surface of the first layer. The columnar structural unit is conductive and aligned in the first layer and the second layer to pass through the major surface. The side portion is added to a side wall of the columnar structural unit on the second layer side of the major surface.
1. A semiconductor device, comprising:
a first layer;
a second layer provided on a major surface of the first layer;
a columnar structural unit formed in the first layer and the second layer, the columnar structural unit passing through the major surface and being conductive, the columnar structural unit including:
a semiconductor layer; and
a charge storage layer provided between the semiconductor layer and at least one of the first layer or the second layer; and
a side portion defined by the first layer, the second layer, and the columnar structural unit, the side portion being a void.
2. The device according to claim 1 , wherein at least one selected from the first layer and the second layer includes a stacked unit including a plurality of insulating films alternately stacked with a plurality of electrode films.
3. The device according to claim 2 , wherein the charge storage layer includes a first silicon oxide film, a second silicon oxide film, and a silicon nitride film provided between the first silicon oxide film and the second silicon oxide film.
4. The device according to claim 1 , wherein at least one selected from the first layer and the second layer includes a single layer film or a stacked film, the single layer film including one selected from a semiconductor layer, a conductive layer, and an insulating layer, the stacked film including at least two selected from a semiconductor layer, a conductive layer, and an insulating layer.
5. The device according to claim 1 , wherein the columnar structural unit includes a first column provided in the first layer and a second column provided in the second layer, an alignment axis of the first column and an alignment axis of the second column being shifted from each other.
6. The device according to claim 5 , wherein at least one selected from the first column and the second column includes at least one selected from copper, aluminum, tungsten, gold, titanium, tantalum, polysilicon doped with an impurity, and amorphous silicon doped with an impurity.
7. The device according to claim 1 , wherein the side portion comprises at least one of a single layer film, a stacked film, or a conductive material film, the single layer film including one selected from silicon nitride, silicon carbide, and aluminum oxide, the stacked film including at least two selected from silicon oxide, silicon nitride, and silicon oxide, the conductive material film including at least one selected from polysilicon and amorphous silicon.
8. A semiconductor device, comprising:
a first layer;
a second layer provided on a major surface of the first layer; and
a columnar structural unit formed in the first layer and the second layer, the columnar structural unit passing through the major surface and being conductive, the columnar structural unit including:
a semiconductor layer; and
a charge storage layer provided between the semiconductor layer and at least one of the first layer and the second layer, the charge storage layer including a protruding portion on the second layer side of the major surface, the protruding portion protruding in a first direction orthogonal to a second direction along which the column structural unit extends.
9. The device according to claim 8 , wherein at least one selected from the first layer and the second layer includes a stacked unit including a plurality of insulating films alternately stacked with a plurality of electrode films.
10. The device according to claim 9 , wherein the charge storage layer includes a first silicon oxide film, a second silicon oxide film, and a silicon nitride film provided between the first silicon oxide film and the second silicon oxide film.
11. The device according to claim 10 , wherein the protruding portion includes at least a portion of at least one selected from the first silicon oxide film, the second silicon oxide film, and the silicon nitride film.
12. The device according to claim 8 , wherein at least one selected from the first layer and the second layer includes a single layer film or a stacked film, the single layer film including one selected from a semiconductor layer, a conductive layer, and an insulating layer, the stacked film including at least two selected from a semiconductor layer, a conductive layer, and an insulating layer.
13. The device according to claim 8 , wherein the columnar structural unit includes a first column provided in the first layer and a second column provided in the second layer, an alignment axis of the first column and an alignment axis of the second column being shifted from each other.