Protective layer for bond pads
A process for forming a protective layer at a surface of an aluminum bond pad. The aluminum bond pad is exposed to a solution containing silicon, ammonium persulfate and tetramethylammonium hydroxide, which results in the formation of the protective layer. This protective layer protects the bond pad surface from corrosion during processing of an imager, such as during formation of a color filter array or a micro-lens array.
1. A aluminum bond pad comprising:
an aluminum material; and
a protective layer formed at an upper surface of the aluminum material,
the protective layer comprising aluminum, silicon and oxygen, wherein the protective layer is formed with a solution having tetramethylammonium hydroxide and silicon,
wherein the protective layer acts to protect the aluminum material from corrosion from exposure to a developing solution, and wherein the developing solution is a tetramethylammonium hydroxide-based solution.
2. The aluminum bond pad of claim 1 , wherein the protective layer has a thickness of up to about 3.5 nm.
3. The aluminum bond pad of claim 2 , wherein the protective layer has a thickness of about 2 nm.
4. The aluminum bond pad of claim 1 , wherein the protective layer comprises about 20% aluminum, about 15% silicon and about 50% oxygen.
5. The aluminum bond pad of claim 1 , wherein the protective layer comprises a lower concentration of aluminum at a surface of the bond pad than at points below the surface.
6. The aluminum bond pad of claim 1 , wherein the protective layer protects the aluminum bond pad from corrosion during a process of forming a color filter array.
7. The aluminum bond pad of claim 1 , wherein the protective layer protects the aluminum bond pad from corrosion during a process of forming of a micro-lens array.
8. The aluminum bond pad of claim 1 , wherein the protective layer does not need to be removed.
9. Apparatus, comprising:
an aluminum bond pad; and
a protective layer formed over the aluminum bond pad, wherein the protective layer comprises aluminum, silicon and oxygen and wherein the protective layer is formed with a solution having tetramethylammonium hydroxide and silicon.
10. The apparatus defined in claim 9 , wherein the protective layer is formed by a wet process.
11. The apparatus defined in claim 9 , wherein the protective layer acts to protect the aluminum bond pad from corrosion from exposure to developing solution in a plurality of subsequent processing steps.
12. The apparatus defined in claim 9 , wherein the array of pixel cells comprises a microlens array and wherein the protective layer acts to protect the aluminum bond pad from corrosion during a reworking process of the microlens array.
13. The apparatus defined in claim 9 , wherein the array of pixel cells comprises a color filter array and wherein the protective layer acts to protect the aluminum bond pad from corrosion during a reworking process of the color filter array.
14. The apparatus defined in claim 9 , wherein the array of pixel cells comprises a microlens array and wherein the protective layer acts to protect the aluminum bond pad from corrosion during formation of the microlens array.
15. The apparatus defined in claim 9 , wherein the array of pixel cells comprises a color filter array and wherein the protective layer acts to protect the aluminum bond pad from corrosion during formation of the color filter array.
16. An integrated circuit, comprising:
an array of pixel cells;
at least one aluminum bond pad; and
a protective layer formed over the at least one aluminum bond pad, wherein the protective layer comprises aluminum, silicon and oxygen, wherein the array of pixel cells is free of the protective layer, and wherein the protective layer is formed with a solution having tetramethylammonium hydroxide and silicon.