Housing for micro-mechanical and micro-optical components used in mobile applications
View Patent ↗The present invention relates to a housing for one or more micromechanical and/or micro-optic components, wherein the housing exhibits a supporting substrate having at least one micromechanical and/or micro-optic component and at least one cap substrate, which is joined to the supporting substrate. The supporting substrate and the at least one cap substrate form at least one cavity, which at least partially encloses the at least one micromechanical and/or micro-optic component, wherein the side of at least one cap substrate facing the at least one micromechanical and/or micro-optic component exhibits at least one optical window and at least one mechanical stop. Furthermore, the object of the present invention is a method for producing such a housing, wherein the method is particularly usable for encapsulation at the wafer level.
1. Housing for one or more microcomponents ( 12 ), exhibiting a supporting substrate ( 1 ), having at least one microcomponent ( 12 ), and at least one cap substrate ( 2 , 3 ), which is joined to the supporting substrate ( 1 )—wherein by means of the supporting substrate ( 1 ) and the at least one cap substrate ( 2 ) at least one cavity ( 5 ) is formed that includes at least partially the at least one microcomponent ( 12 )—and the side of which cap substrate facing the at least one microcomponent ( 12 ) exhibits an optical window ( 13 ) and a mechanical stop ( 8 ) characterized in that the mechanical stop ( 8 ) is integral with the cap substrate ( 2 , 3 ) and the optical window ( 13 ) exhibits an evenness and/or plane parallelism deviation of less than or equal to 3.75 μm.
2. Housing according to claim 1 characterized in that the mechanical stop ( 8 ) protrudes from said side of the cap substrate facing the at least one microcomponent ( 12 ).
3. Housing according to claim 1 characterized in that the at least one cap substrate ( 2 , 3 ) exhibits at least one recess ( 4 ) that is deeper than 900 μm.
4. Housing according to claim 1 characterized in that the at least one cap substrate ( 2 , 3 ) contains glass and/or another vitroid at least in parts.
5. Housing according to claim 4 characterized in that the glass is a silicate glass.
6. Housing according to claim 5 characterized in that the silicate glass is a borosilicate glass.
7. Housing according to claim 1 characterized in that the optical window ( 13 ) exhibits an evenness and/or plane parallelism deviation of less than or equal to 180 nm.
8. Housing according to claim 1 characterized in that the optical window ( 13 ) exhibits a root-mean-square roughness of less than or equal to 15 nm.
9. Housing according to claim 8 characterized in that the optical window ( 13 ) exhibits a root-mean-square roughness of less than or equal to 5 nm.
10. Method for producing a housing for one or more microcomponents ( 12 ), exhibiting a supporting substrate ( 1 ), having at least one microcomponent ( 12 ), and at least one cap substrate ( 2 , 3 ), which is joined to the supporting substrate ( 1 )—wherein by means of the supporting substrate ( 1 ) and the at least one cap substrate ( 2 ) at least one cavity ( 5 ) is formed that includes at least partially the at least one microcomponent ( 12 )—and the side of which cap substrate facing the at least one microcomponent ( 12 ) exhibits an optical window ( 13 ) and a mechanical stop ( 8 ), said method comprising the following steps:
providing said supporting substrate ( 1 ) having at least one microcomponent ( 12 )
providing said at least one cap substrate ( 2 , 3 ) patterned using a glass flow method,
joining said supporting substrate ( 1 ) to said at least one cap substrate ( 2 , 3 ) so that the supporting substrate ( 1 ) and the at least one cap substrate ( 2 , 3 ) form said at least one cavity ( 5 ) that encloses said at least one microcomponent ( 12 ) at least partially.
11. Method according to claim 10 characterized in that the supporting substrate ( 1 ) is joined to the at least one cap substrate ( 2 , 3 ) at a pressure lower than the atmospheric pressure.
12. Method according to claim 10 characterized in that the supporting substrate ( 1 ) is joined to the at least one cap substrate ( 2 , 3 ) in an inert gas atmosphere.
13. Method according to claim 12 characterized in that the inert gas atmosphere contains or consists of argon.