Contactless communication medium
Even when a mold part of an IC module is exposed from an opening provided in a substrate of an inlay, occurrence of malfunction, communication disorders or the like of the IC module due to the influence of an external impact or the like is prevented. By combining a sealing member including an insulating layer and an adhesive layer in a stacked manner to a shape covering a mold part of the IC module, occurrence of malfunction, communication disorders or the like of the IC module is prevented even if there is an influence of an external impact or the like. Meanwhile, by providing a sealing member, concentration of stress on the mold part in a line pressure test is alleviated by limiting the size of the sealing member, and also occurrence of cracks in the mold part can be prevented.
1. A contactless communication medium, comprising:
a first substrate, a second substrate, an antenna formed on the second substrate, and an IC module connected to the antenna; wherein:
the IC module has at least a lead frame, an IC chip mounted on the lead frame, and a mold part for sealing the IC chip;
the first substrate has an opening for exposing the mold part;
the second substrate has a hole or recessed part for accommodating at least the mold part, the hole or recessed part having an area size larger than the mold part;
a sealing member having an insulating layer and an adhesive layer in a stacked manner is located so as to cover the mold part, the sealing member being bonded to the mold part via the adhesive layer; and
where the sealing member has a transverse width × and a longitudinal width y, the hole or recessed part of the second substrate has a transverse width a and a longitudinal width b, and the first substrate has a thickness of d, at least one of the following expressions:
x<a+ 2 d (1)
and
y<b+ 2 d (2)
is fulfilled.
2. A contactless communication medium according to claim 1 , wherein only numerical expression (2) is fulfilled.
3. A contactless communication medium according to claim 1 , wherein the sealing member further fulfills at least one of the following expressions:
x<a+ 2 d− 0.2 mm (3)
and
y<b+ 2 d− 0.2 mm (4).
4. A contactless communication medium according to claim 3 , wherein only numerical expression (4) is fulfilled.
5. A contactless communication medium according to claim 1 , wherein an outer surface of the first substrate and an outer surface of the sealing member are formed to be generally flat.
6. A contactless communication medium according to claim 5 , wherein a step between the outer surface of the first substrate and the outer surface of the sealing member is 20 μm or less.
7. A contactless communication medium according to claim 1 , wherein at least one of the insulating layer and the adhesive layer of the sealing member has a longitudinal elastic modulus which is smaller than that of the mold part.
8. A contactless communication medium, comprising:
a first substrate, a second substrate, an antenna formed on the second substrate, and an IC module connected to the antenna; wherein:
the IC module has at least a lead frame, an IC chip mounted on the lead frame, and a mold part for sealing the IC chip;
the first substrate has an opening for exposing the mold part;
the lead frame is connected at a connection part of the antenna provided on the second substrate;
a sealing member having an insulating layer and an adhesive layer in a stacked manner is located so as to cover the mold part, the sealing member being bonded to the mold part via the adhesive layer; and
the sealing member is bonded to the second substrate via the adhesive layer in one direction in which the IC module and the antenna are connected to each other, among two directions parallel to sides of the mold part for sealing the IC chip; and the sealing member is provided so as not to contact the second substrate in the direction perpendicular to the one direction.
9. A contactless communication medium according to claim 8 , wherein an outer surface of the first substrate and an outer surface of the sealing member are formed to be generally flat.
10. A contactless communication medium according to claim 9 , wherein a step between the outer surface of the first substrate and the outer surface of the sealing member is 20 μm or less.
11. A contactless communication medium according to claim 8 , wherein at least one of the insulating layer and the adhesive layer of the sealing member has a longitudinal elastic modulus which is smaller than that of the mold part.