Method of forming metal pillar
View Patent ↗The disclosure relates to fabrication of to a metal pillar. An exemplary method of fabricating a semiconductor device comprises the steps of providing a substrate having a contact pad; forming a passivation layer extending over the substrate having an opening over the contact pad; forming a metal pillar over the contact pad and a portion of the passivation layer; forming a solder layer over the metal pillar; and causing sidewalls of the metal pillar to react with an organic compound to form a self-assembled monolayer or self-assembled multi-layers of the organic compound on the sidewalls of the metal pillar.
1. A method for fabricating a semiconductor device, comprising:
providing a substrate having a contact pad;
forming a passivation layer extending over the substrate and having an opening over the contact pad;
forming a metal pillar over the contact pad and a portion of the passivation layer;
forming a solder layer over the metal pillar; and
causing sidewalls of the metal pillar to react with an organic compound to form a self-assembled monolayer of the organic compound on the sidewalls of the metal pillar.
2. The method of claim 1 , wherein the organic compound is in a solution.
3. The method of claim 2 , wherein the step of reacting sidewalls of the metal pillar with an organic compound is performed at a temperature of about 20 to 50° C.
4. The method of claim 1 , wherein the organic compound is in a vapor phase.
5. The method of claim 1 , wherein the organic compound comprises a head group, a functional group and a tail group between the head group and the functional group.
6. The method of claim 5 , wherein the head group is a thiol group (—SH).
7. The method of claim 5 , wherein the functional group comprises CH 3 , OH, NH 2 , or COOH.
8. The method of claim 5 , wherein the tail group comprises a carbon chain having carbon number between 4 and 20.
9. The method of claim 1 , wherein the metal pillar is a copper pillar.
10. The method of claim 1 further comprising: cleaning the sidewalls of metal pillar with de-ionized water, citric acid and IPA before the reaction of the sidewalls of the metal pillar with an organic compound.
11. The method of claim 1 further comprising: treating the substrate with IPA after the reaction of the sidewalls of the metal pillar with an organic compound.
12. A method for fabricating a semiconductor device, comprising:
providing a substrate having a contact pad;
forming a passivation layer extending over the substrate having an opening over the contact pad;
forming a metal pillar over the contact pad and a portion of the passivation layer;
forming a solder layer over the metal pillar; and
causing sidewalls of the metal pillar to react with an organic compound to form self-assembled multi-layers of the organic compound on the sidewalls of the metal pillar.
13. The method of claim 12 , wherein the organic compound is in a solution.
14. The method of claim 13 , wherein the solution comprises metal ions of zinc ions, copper ions, nickel ions, cobalt ions, iron ions, or combination thereof.
15. The method of claim 12 , wherein the step of reacting sidewalls of the metal pillar with an organic compound is performed at a temperature of about 20 to 50° C.
16. The method of claim 12 , wherein the organic compound comprises a benzimidazole or benzimidazole derivative.
17. The method of claim 12 , wherein the organic compound comprises an imidazole or imidazole derivative.
18. The method of claim 12 , wherein the metal pillar is a copper pillar.
19. The method of claim 12 further comprising: cleaning the sidewalls of metal pillar with an acid solution before the reaction of the sidewalls of the metal pillar with an organic compound.
20. The method of claim 12 further comprising: drying the substrate with an inert gas after the reaction of the sidewalls of the metal pillar with an organic compound.