Hot melt compositions
Hot melt compositions include acid waxes and acrylate functional monomers free of acid groups. Upon application of actinic radiation, the hot melt compositions cure to form and etch resist. The hot melt compositions may be used in the manufacture of printed circuit boards, optoelectronic and photovoltaic devices.
1. A composition comprising one or more acid waxes, one or more acrylate functional monomers free of acid groups and one or more radical initiators.
2. The composition of claim 1 , wherein the acid value of the one or more waxes is at least 100 mg KOH/g.
3. The composition of claim 2 , wherein the acid value of the one or more waxes is 120 mg to 170 mg KOH/g.
4. The composition of claim 1 , wherein the composition further comprises one or more colorants.
5. The composition of claim 1 , wherein the composition is free of any acrylate functional monomers comprising acid groups.
6. A method comprising:
a. providing a composition comprising one or more acid waxes, one or more acrylate functional monomers free of acid groups and one or more radical initiators;
b. selectively depositing the composition on a substrate;
c. applying actinic radiation to the composition to cure the composition;
d. etching sections of the substrate not covered with the cured composition; and
e. removing the cured composition from the substrate with a base to form a patterned article.
7. The method of claim 6 , wherein the acid value of the one or more waxes is at least 100 mg KOH/g.
8. The method of claim 6 , wherein the substrate is chosen from a component of a printed circuit board, a photovoltaic device, an optoelectronic device, metal parts and lead frames.
9. A method comprising:
a. providing a composition comprising one or more acid waxes, one or more acrylate functional monomers free of acid groups and one or more radical initiators;
b. selectively depositing the composition on a substrate;
c. applying actinic radiation to the composition to cure the composition;
d. plating metal onto the sections of the substrate not covered with the cured composition; and
e. removing the cured composition with a base to form a patterned article.