Method of manufacturing trenched MOSFETs with embedded Schottky in the same cell
A method for manufacturing a trenched semiconductor power device includes a step of forming said semiconductor power device with a trenched gate surrounded by a source region encompassed in a body region above a drain region disposed on a bottom surface of a substrate. The method further includes the steps of covering the MOSFET cell with an insulation layer and applying a contact mask for opening a source-body contact trench extending through the source and body regions into an epitaxial layer underneath for filling a contact metal plug therein. And, the method further includes a step of forming an embedded Schottky diode by forming a Schottky barrier layer near a bottom of the source-body contact trench below the contact metal plug with the Schottky barrier layer having a barrier height for reducing a leakage current through the embedded Schottky diode during a reverse bias between the drain and the source.
1. A method for manufacturing a metal oxide semiconductor field effect transistor (MOSFET) comprising a step of forming said MOSFET with a trenched gate surrounded by a source region encompassed in a body region above a drain region disposed on a bottom surface of a substrate, the method further comprising:
covering said MOSFET cell with an insulation layer and applying a contact mask for opening a source-body contact trench extending through said source and body regions and into an epitaxial layer below said body region for filling a contact metal plug therein;
forming an embedded Schottky diode by forming a Schottky barrier layer along sidewall of said source-body contact trench in said epitaxial layer and near a bottom of said source-body contact trench below said contact metal plug with said Schottky barrier layer having a barrier height for reducing a leakage current through said embedded Schottky diode during a reverse bias between said drain and said source and
forming a source-dopant region below said source-body contact trench in contact with said Schottky barrier layer of said Schottky diode having a different dopant concentration from said epitaxial layer surrounding said body region supported on said semiconductor substrate.
2. The method of claim 1 further comprising a step of:
forming a contact enhancement dopant region along sidewalls of said source-body contact trench for improving an electrical contact of said contact metal plug to said body regions.
3. The method of claim 1 wherein:
said step of forming said embedded Schottky diode further comprising a step of forming a CoSi2/TiN barrier layer at a bottom surface of said source-body contact trench.
4. The method of claim 1 wherein:
said step of forming said embedded Schottky diode further comprising a step of forming a PtSi barrier layer at a bottom surface of said source-body contact trench.
5. The method of claim 1 further comprising:
forming said source-dopant region below said source-body contact trench in contact with said barrier layer of said Schottky diode having a dopant concentration of N 2 with N 2 >N 1 where N 1 is a dopant concentration of an epitaxial layer surrounding said body region supported on said semiconductor substrate.
6. The method of claim 1 further comprising:
forming said source-dopant region below said source-body contact trench in contact with said barrier layer of said Schottky diode having a dopant concentration of N 2 with N 2 <N 1 to reduce a Drain-Source leakage current at a reverse bias where N 1 is a dopant concentration of an epitaxial layer surrounding said body region supported on said semiconductor substrate.
7. The method of claim 1 further comprising:
forming said source-dopant region below said source-body contact trench in contact with said barrier layer of said Schottky diode having a dopant concentration of N 2 with N 2 >N 1 where N 1 is a dopant concentration of an epitaxial layer surrounding said body region supported on said semiconductor substrate; and
forming a gate insulation layer padded on sidewalls and a bottom surface of said trenched gate and filling said trenched gate with a dielectric material by with said gate insulation layer on said bottom surface of said trenched gate significantly thicker than said gate insulation layer disposed along sidewalls of said trenched gate.
8. The method of claim 1 further comprising:
forming a gate insulation layer padded on sidewalls and a bottom surface of said trenched gate and filling said trenched gate with a dielectric material by with said gate insulation layer on said bottom surface of said trenched gate substantially same as said gate insulation layer disposed along sidewalls of said trenched gate.
9. The method of claim 1 further comprising:
forming a source-dopant region below said source-body contact trench in contact with said barrier layer of said Schottky diode having a dopant concentration of N 2 with N 2 <N 1 to reduce a Drain-Source leakage current at a reverse bias where N 1 is a dopant concentration of an epitaxial layer surrounding said body region supported on said semiconductor substrate; and
forming a gate insulation layer padded on sidewalls and a bottom surface of said trenched gate and filling said trenched gate with a dielectric material by with said gate insulation layer on said bottom surface of said trenched gate significantly thicker than said gate insulation layer disposed along sidewalls of said trenched gate.