IP Library Granted Patent US 8,253,027
Granted Patent B2
US 8,253,027 · App. 12/712,034 · Granted Aug 28, 2012

Circuit board and structure using the same

Assignee: Kyocera Corporation
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Quick Facts
Patent No.
US 8,253,027
App. No.
12/712,034
Granted
Aug 28, 2012
Kind
B2
Abstract

According to one embodiment of the invention, a circuit board comprises a conductive layer including a land portion and a line portion connected to the land portion, and; a conductor connected to a surface of the land portion. A planar shape of the connected portion between the conductor and the land portion has a elongated shape along a width direction of the line portion. A part of the connected portion is located within an imaginary region formed by imaginarily extending the line portion toward the land portion.

Claims (18)

1. A circuit board comprising:

a conductive layer including a land portion, and a line portion connected to the land portion, and;

a conductor connected to a surface of the land portion;

wherein, in a planar view, a shape of the connected portion between the conductor and the land portion is an elongated shape along a width direction of the line portion, and at least a part of the connected portion is located within an imaginary region formed by imaginarily extending the line portion toward the land portion.

2. The circuit board according to claim 1 , wherein the shape of the connected portion has a first long side and a second long side along the width direction of the line portion, wherein the second long side is closer to the line-portion than the first long side is, and

the second long side includes convex portions projecting toward the line portion.

3. The circuit board according to claim 2 , wherein the second long side further includes a concave portion between the adjacent convex portions.

4. The circuit board according to claim 3 , wherein the concave portion is located closer to a center of the imaginary region than the adjacent convex portions are.

5. The circuit board according to claim 3 , wherein

the land portion has a cavity portion in which a part of the conductors is filled, and the cavity has a first region corresponding to the concave portion, and

a second region other than the first region, the first region of the cavity is deeper than the second region thereof.

6. The circuit board according to claim 1 , wherein

a whole area of the shape of the connected portion is located within the imaginary region.

7. A structure comprising:

the circuit board according to claim 1 ; and

an electronic component electrically connected to the conductive layer and the conductor in the circuit board.

8. The circuit board according to claim 1 , wherein in the planar view, the shape of the connected portion has a shape in which a plurality of circles are arranged in the width direction of the linear portion so as to partially overlap with each other.

9. The circuit board according to claim 1 , wherein in the planar view, the shape of the connected portion has an elliptical shape with a major axis that extends in the width direction of the linear portion.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 11, 2010
From: YAMANAKA, KIMIHIRO; ICHINOSE, MANABU; NAKAMURA, SATOSHI
To: KYOCERA CORPORATION
Reel/Frame 024069/0386 →
Priority Claims (1)
JP 2009-042841 · Feb 25, 2009 · national
Continuity (1)
Related Publication 20100212947A1 · Aug 26, 2010