IP Library Granted Patent US 8,253,215
Granted Patent B2
US 8,253,215 · App. 12/687,257 · Granted Aug 28, 2012

Mesa heterojunction phototransistor and method for making same

Assignee: Wavefront Holdings, LLC
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,253,215
App. No.
12/687,257
Granted
Aug 28, 2012
Kind
B2
Abstract

A two-terminal mesa phototransistor and a method for making it are disclosed. The photo transistor has a mesa structure having a substantially planar semiconductor surface. In the mesa structure is a first semiconductor region of a first doping type, and a second semiconductor region of a second doping type opposite to that of the first semiconductor region, forming a first semiconductor junction with the first region. In addition, a third semiconductor region of the first doping type forms a second semiconductor junction with the second region. The structure also includes a dielectric layer. The second semiconductor region, first semiconductor junction, and second semiconductor junction each has an intersection with the substantially planar semiconductor surface. The dielectric covers, and is in physical contact with, all of the intersections.

Claims (35)

1. A two-terminal mesa phototransistor, comprising:

a mesa structure having at least one substantially planar semiconductor surface;

a first semiconductor region of a first doping type;

a second semiconductor region of a second doping type opposite to the doping type of the first semiconductor region, forming a first semiconductor junction with the first semiconductor region;

a third semiconductor region of the first doping type forming a second semiconductor junction with the second semiconductor region; and

a substantially planar portion of a dielectric layer in direct physical contact with the first semiconductor region, the first semiconductor junction, the second semiconductor region, the second semiconductor junction, and the third semiconductor region, simultaneously;

wherein the second semiconductor region, the first semiconductor junction, and the second semiconductor junction each is in direct physical contact with the substantially planar portion of the dielectric layer at and only at the one substantially planar semiconductor surface;

wherein the second semiconductor region, the first semiconductor junction, and the second semiconductor junction is in direct physical contact with the dielectric layer only at the substantially planar portion of the dielectric layer at the one substantially planar semiconductor surface; and

wherein the first semiconductor region, the third semiconductor region, and the substantially planar portion of the dielectric layer together completely encapsulate the first semiconductor junction, the second semiconductor region, and the second semiconductor junction.

2. The phototransistor of claim 1 , wherein at least one of the first or second semiconductor junctions is a heterojunction.

3. The phototransistor of claim 1 , wherein the second semiconductor region is configured to function as a floating bipolar transistor base.

4. The phototransistor of claim 3 , wherein the first semiconductor region and the third semiconductor region are respectively configured to function as an emitter and a collector of the phototransistor.

5. The phototransistor of claim 3 , wherein the first semiconductor region and the third semiconductor region are respectively configured to function as a collector and an emitter of the phototransistor.

6. The phototransistor of claim 1 , wherein the one substantially planar semiconductor surface is a top surface of the mesa structure.

7. The phototransistor of claim 1 , wherein the dielectric layer comprises at least one of: a grown oxide, a deposited oxide, a native oxide, silicon nitride SiN x , or a high-k dielectric.

8. The phototransistor of claim 7 , wherein the high-k dielectric comprises at least one of aluminum oxide (Al 2 O 3 ), titanium dioxide (TiO 2 ), tantalum pentoxide (Ta 2 O 5 ), hafnium dioxide (HfO 2 ), hafnium silicate (HfSiO 4 ), hafnium silicon oxynitride, zirconium oxide (ZrO 2 ), zirconium silicate (ZrSiO 4 ), or lanthanum oxide (La 2 O 3 ).

9. The device of claim 1 , further comprising a second electrically insulating dielectric layer covering the substantially planar portion of the dielectric layer.

10. A two-terminal mesa phototransistor, comprising:

a mesa structure having a substantially planar semiconductor surface;

a first semiconductor region of a first doping type;

a second semiconductor region of a second doping type opposite to the doping type of the first semiconductor region, forming a first semiconductor junction with the first semiconductor region;

a third semiconductor region of the first doping type forming a second semiconductor junction with the second semiconductor region; and

a substantially planar portion of a dielectric in direct physical contact with at least a portion of the substantially planar semiconductor surface;

wherein the first semiconductor region, the third semiconductor region, and the substantially planar portion of the dielectric together completely encapsulate the first semiconductor junction, the second semiconductor region, and the second semiconductor junction;

wherein the first semiconductor region, the second semiconductor region, and the substantially planar portion of the dielectric together completely encapsulate the first semiconductor junction;

wherein the first semiconductor junction, the second semiconductor junction, and the substantially planar portion of the dielectric together completely encapsulate the second semiconductor region; and

wherein the second semiconductor region, the third semiconductor region, and the substantially planar portion of the dielectric together completely encapsulate the second semiconductor junction.

11. The phototransistor of claim 10 , wherein at least one of the first or second semiconductor junctions is a heterojunction.

12. The phototransistor of claim 10 , wherein the second semiconductor region is configured to function as a floating bipolar transistor base.

13. The phototransistor of claim 12 , wherein the first semiconductor region and the third semiconductor region are respectively configured to function as an emitter and a collector of the phototransistor.

14. The phototransistor of claim 12 , wherein the first semiconductor region and the third semiconductor region are respectively configured to function as a collector and an emitter of the phototransistor.

15. The phototransistor of claim 10 , wherein the substantially planar semiconductor surface is a top surface of the mesa structure.

16. The phototransistor of claim 10 , wherein the dielectric layer comprises at least one of: a grown oxide, a deposited oxide, a native oxide, silicon nitride SiN x , or a high-k dielectric.

17. The phototransistor of claim 16 , wherein the high-k dielectric comprises at least one of aluminum oxide (Al 2 O 3 ), titanium dioxide (TiO 2 ), tantalum pentoxide (Ta 2 O 5 ), hafnium dioxide (HfO 2 ), hafnium silicate (HfSiO 4 ), hafnium silicon oxynitride, zirconium oxide(ZrO 2 ),zirconium silicate (ZrSiO 4 ), or lanthanum oxide (La 2 O 3 ).

18. The device of claim 10 , further comprising a second electrically insulating dielectric layer covering the substantially planar portion of the dielectric.

Assignments (2)
CONFIRMATORY LICENSE Recorded Jul 13, 2021
From: WAVEFRONT LLC
To: THE GOVERNMENT OF THE UNITED STATES AS REPRSENTED BY THE SECRETARY OF THE AIR FORCE
Reel/Frame 056851/0404 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2010
From: YAO, JIE
To: WAVEFRONT HOLDINGS, LLC
Reel/Frame 025614/0577 →
Continuity (2)
Provisional Application 61144906 · Jan 15, 2009
Related Publication 20100176420A1 · Jul 15, 2010