Disabling electrical connections using pass-through 3D interconnects and associated systems and methods
Pass-through 3D interconnects and microelectronic dies and systems of stacked dies that include such interconnects to disable electrical connections are disclosed herein. In one embodiment, a system of stacked dies includes a first microelectronic die having a backside, an interconnect extending through the first die to the backside, an integrated circuit electrically coupled to the interconnect, and a first electrostatic discharge (ESD) device electrically isolated from the interconnect. A second microelectronic die has a front side coupled to the backside of the first die, a metal contact at the front side electrically coupled to the interconnect, and a second ESD device electrically coupled to the metal contact. In another embodiment, the first die further includes a substrate carrying the integrated circuit and the first ESD device, and the interconnect is positioned in the substrate to disable an electrical connection between the first ESD device and the interconnect.
1. A system of stacked microelectronic dies, comprising:
a first microelectronic die comprising a backside, an integrated circuit, a first electrostatic discharge (ESD) device, an electrical line electrically coupled to the first ESD, and an interconnect extending through the first die to the backside, wherein the interconnect is electrically coupled to the integrated circuit, and wherein the electrical line is disabled such that the first ESD device is electrically isolated from the interconnect; and
a second microelectronic die comprising a front side coupled to the backside of the first die, a metal contact at the front side electrically coupled to the interconnect, and a second ESD device electrically coupled to the metal contact, wherein the integrated circuit of the first die is electrically coupled to the second ESD device.
2. The system of claim 1 , further comprising a metal bond coupling the metal contact of the second die with the interconnect of the first die, wherein the second ESD device is electrically coupled to the integrated circuit via the metal bond.
3. The system of claim 1 wherein the first die further includes a substrate carrying the integrated circuit and the first ESD device, and wherein the interconnect is positioned in the substrate such that an electrical connection between the first ESD device and the interconnect is disabled.
4. The system of claim 1 , further comprising a dielectric layer at least partially lining the interconnect and electrically isolating the first ESD device from the interconnect.
5. The system of claim 1 wherein the second die includes an integrated circuit electrically coupled to the second ESD device.
6. The system of claim 1 , further comprising an interposer substrate carrying the first and second dies, the interposer substrate including a metal pad electrically coupled to the integrated circuit and the second ESD device, the metal pad also being electrically isolated from the first ESD device.
7. A microelectronic workpiece, comprising:
a substrate having a front side and a backside;
a first circuit electrically coupled to the front side of the substrate and a second circuit disposed at least in part within the substrate;
an interconnect extending through the substrate from the front side to the backside and electrically coupled to the first circuit, the interconnect having a metal layer electrically coupling the front side of the substrate with the backside of the substrate;
a dielectric liner disposed along at least a portion of a length of the interconnect between the interconnect and the substrate wherein the dielectric liner electrically isolates the first circuit from the second circuit; and
wherein the first circuit comprises an integrated circuit and the second circuit comprises an electrostatic discharge device.
8. An interconnect structure, comprising:
a first metal layer disposed on a microelectronic die;
a second metal layer disposed on the die and being separated from the first metal layer;
a metal interconnect extending through the die from, at least, a surface at a front side of the die to a surface at a backside of the die, the interconnect also extending through the first metal layer and the second metal layer;
a dielectric layer at least partially lining the interconnect and electrically isolating the first and second metal layers from one another; and
wherein the die supports an electrostatic discharge (ESD) device, the second metal layer provides a conduction path to the ESD device, and the dielectric layer electrically isolates the conduction path from the first metal layer.
9. The interconnect structure of claim 8 wherein the first and second metal layers are located within a microelectronic substrate carried by the die.
10. The interconnect structure of claim 8 wherein the first and second metal layers are located within a redistribution layer attached to the surface at the front side of the die.