Method for the production and control of plates for electronics and related apparatus
A method for the production and control of plates for electronics comprising a first step in which a plate is positioned, by means of positioning means, in a loading station; a second step in which the plate is disposed in a deposition station associated with a unit for depositing metal, or other material, in which the metal is deposited on the plate, in order to generate on the plates metal tracks, according to a pre-determined and desired topological disposition; a third step in which the plate is disposed in an exit station and a detection means is activated so as to detect the presence of defects in the plate; and a fourth step in which the plate is discharged from the exit station. In the first step the detection means is activated to identify defects in the plate disposed in the loading station. In the second step the deposition unit is activated in order to deposit the metal on the plate when in the first step the detection means has not detected any defect in the plate.
1. A wafer processing apparatus, comprising:
a loading station;
an exit station;
at least one deposition station;
a discharge station;
a pivoting turret having a plurality of sliding belts mounted around the pivoting turret, wherein the loading station, the deposition station, the exit station and the discharge station are positioned around the pivoting turret such that the pivoting turret can transfer a wafer between the loading station, the deposition station, the exit station and the discharge station, wherein, following a direction of pivoting, the deposition station is positioned between the loading station and the exit station, and the discharge station is positioned between the exit station and the loading station;
a first inspection device positioned to detect defects in wafers disposed in the loading station;
a second inspection device positioned to detect defects in wafers disposed in the exit station; and
a control unit programmed to inspect the wafer using the second inspection device and to discharge the wafer from the exit station along a first direction of discharge if no defects are detected by the second inspection device and to discharge the wafer from the discharge station along a second direction of discharge if defects are detected by the second inspection device.
2. The apparatus of claim 1 , wherein the pivoting turret is positioned to discharge wafers with defects from the discharge station towards an adjacent collection container for defective wafers.
3. The apparatus of claim 1 , wherein the first and second inspection devices each comprise at least a TV camera.
4. The apparatus of claim 2 , wherein the control unit is configured to activate the deposition station if the first inspection device indicates the wafer has no defect, and then to activate the second inspection device after the deposition.
5. The apparatus of claim 4 , further comprising an air suction device for removing impurities from at least one of the sliding belts, wherein the air suction device is activated by the control unit.
6. A wafer processing apparatus, comprising:
a loading station;
an exit station;
at least one deposition station positioned between the loading station and the exit station;
a discharge station positioned between the exit station and the loading station;
at least one deposition unit positioned over the at least one deposition station;
a pivoting turret having a plurality of sliding belts arranged around the pivoting turret, wherein the pivoting turret is positioned to transfer wafers between the loading station, the deposition station, the exit station, and the discharge station on the sliding belts;
a first inspection means positioned to detect defects in wafers disposed in the loading station;
a second inspection means positioned to detect defects in wafers disposed in the exit station; and
a control unit programmed to inspect the wafer using the second inspection means and to discharge the wafer from the exit station along a first direction of discharge if no defects are detected by the second means device and to discharge the wafer from the discharge station along a second direction of discharge if defects are detected by the second inspection device.
7. The apparatus of claim 6 , further comprising means to remove impurities from the sliding belts positioned in at least one of the exit station and discharge station.
8. The apparatus of claim 7 , wherein the means to remove impurities comprises an air suction device.
9. The apparatus of claim 6 , further comprising a collection container positioned adjacent the discharge station.
10. The wafer processing apparatus of claim 2 , wherein:
the control unit is programmed to perform a method, the method comprising:
positioning a wafer in a loading station;
inspecting the wafer to detect defects using the first inspection device;
positioning the wafer in a deposition station;
depositing metal or other material onto the wafer if defects were not detected during inspection;
positioning the wafer in an exit station;
inspecting the wafer and deposited metal or other materials to detect defects using the second inspection device; and
positioning the wafer in a discharge station if defects were detected during inspection.
11. The wafer processing apparatus of claim 10 , wherein the control unit is further programmed to clean at least one of the exit station and discharge station after discharging the wafer.
12. The wafer processing apparatus of claim 11 , wherein cleaning at least one of the exit station and discharge station after discharging the wafer comprises cleaning by means of air suction.
13. The wafer processing apparatus of claim 10 , wherein the first and second inspection devices each comprise at least one TV camera.