IP Library › Granted Patent US 8,258,254
Granted Patent B2
US 8,258,254 · App. 10/518,859 · Granted Sep 4, 2012

Biodegradable resin, biodegradable resin composition, biodegradable molded object, and process for producing biodegradable resin

Assignee: NEC Corporation
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Quick Facts
Patent No.
US 8,258,254
App. No.
10/518,859
Granted
Sep 4, 2012
Kind
B2
Abstract

A biodegradable resin having sufficient heat resistance, molding property and recycling property can be obtained, without losing biodegradability, by introducing a covalently bonded and thermo-reversible cross-linked structure into a biodegradable resin. Heat resistance, molding property, recycling property and biodegradability can be further improved, if necessary, by setting the cleaving temperature of a cross-linked structure in a given range, selecting the kind of a cross-linked structure, and making a three-dimensional cross-linked structure.

Claims (6)

1. A biodegradable moldable resin having a Diels-Alder type functional group selected from the group consisting of an alkenyl group and a group having a conjugated double bond wherein said biodegradable moldable resin is polybutylene succinate or modified body of the polybutylene succinate.

2. The biodegradable moldable resin according to claim 1 , wherein said biodegradable moldable resin has a three-dimensional cross-linked structure, and the cross-linked density of the three-dimensional cross-linked structure is 0.0001 to 1.

3. The biodegradable moldable resin according to claim 1 , wherein the main chain of said biodegradable moldable resin has at least one of a linear structure and branched structure.

4. The biodegradable moldable resin according to claim 1 , wherein one or more of said functional groups are present at the same site, at least one of the end and side chain of said biodegradable moldable resin.

5. The biodegradable moldable resin according to claim 1 , wherein an electrostatically bondable and thermo-reversible cross-linked structure is used together.

6. The biodegradable moldable resin of claim 1 wherein the functional group is selected from the group consisting of cyclic dienes and cyclic dienophiles.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2004
From: INOUE, KAZUHIKO; YAMASHIRO, MIDORI; IJI, MASATOSHI
To: NEC CORPORATION
Reel/Frame 016977/0630 →
Priority Claims (1)
JP 2002-175646 · Jun 17, 2002 · national
Continuity (1)
Related Publication 20060025560A1 · Feb 2, 2006