Components, systems, and methods for associating sensor data with component location
Components having one or more sensors adapted to provide sensor data relating to a condition(s) of the component are disclosed. The component is adapted to communicate with another mating component to associate sensor data with identity information of the mating component. The sensor and identity information can be communicated remotely including via radio-frequency communications employing RF identification devices (RFIDs). Location of the mating component can be determined using the identity information of the mating component. In this manner, the sensor data can be associated with the location of the mating component using the identity information in a “component-to-component” configuration to provide location-specific sensor data. Having the ability to localize sensor data to a specific location can assist in pinpointing areas where performance or other condition issues may exist in a component, a mating component, an article of manufacture associated with the components, and/or communication and/or transmissions lines coupled between components.
1. A component system, comprising:
an integrated circuit (IC);
one or more electrical leads; and
one or more sensors coupled to the IC configured to provide sensor data;
wherein the IC is configured to communicate with a second IC in a mating component when the one or more electrical leads are coupled to one or more electrical leads on the mating component to associate the sensor data with identity information of the mating component; and
wherein the one or more sensors are coupled to the IC, the second IC, or both the IC and the second IC;
a third IC electrically coupled to the second IC; and
a second one or more sensors coupled to the third IC and configured to communicate second sensor data to the third IC;
wherein the third IC is configured to communicate the second sensor data to the second IC.
2. The component system of claim 1 , wherein the IC is configured to communicate the sensor data over the one or more electrical leads to the mating component to associate the sensor data with the identity information of the mating component.
3. The component system of claim 1 , wherein the IC is configured to receive the identity information of the mating component over the one or more electrical leads to associate the sensor data with the identity information of the mating component.
4. The component system of claim 1 , wherein the IC is RFID-enabled and coupled to an antenna to provide an RFID-transponder configured to communicate to an RFID reader.
5. The component system of claim 4 , wherein the RFID transponder is configured to communicate the sensor data to the RFID reader.
6. The component system of claim 4 , wherein the RFID transponder is configured to:
receive the identity information of the mating component over the one or more electrical leads to associate the sensor data with the identity information of the mating component; and
communicate the identity information of the mating component to the RFID reader.
7. The component system of claim 4 , further comprising a power supply configured to supplementally power the RFID transponder.
8. The component system of claim 1 , further comprising:
a second IC electrically coupled to the IC; and
a second one or more sensors coupled to the second IC and configured to communicate second sensor data relating to the component to the second IC;
wherein the second IC is configured to communicate the second sensor data to the IC.
9. The component system of claim 8 , wherein the IC is RFID-enabled and is coupled to an antenna to provide an RFID transponder configured to communicate either the sensor data, the second sensor data, or both the sensor data and the second sensor data to an RFID reader.
10. The component system of claim 8 , wherein the second IC is RFID-enabled and is coupled to a second antenna to provide a second RFID transponder;
wherein the IC is configured to communicate the sensor data to the second RFID transponder.
11. The component system of claim 10 , wherein the second RFID transponder is configured to communicate either the sensor data, the second sensor data, or both the sensor data and the second sensor data to an RFID reader.
12. The component system of claim 10 , wherein the second RFID transponder is configured to:
receive the identity information of the mating component; and
communicate the identity information of the mating component to the RFID reader.
13. The component system of claim 8 , wherein the IC is RFID-enabled and is coupled to an antenna to provide an RFID transponder and the second IC is RFID-enabled and is coupled to a second antenna to provide a second RFID transponder;
wherein the RFID transponder is configured to communicate the sensor data over the antenna to the second RFID transponder via the second antenna.
14. The component system of claim 1 , wherein the mating component further comprises one or more second electrical leads coupled to the second IC;
wherein the IC and the second IC are configured to communicate with each other when the one or more electrical leads are coupled to the one or more second electrical leads.
15. The component system of claim 1 , wherein the second IC is RFID-enabled and is coupled to an antenna to provide a second RFID transponder.
16. The component system of claim 15 , wherein the second RFID transponder is configured to communicate the sensor data to an RFID reader.
17. The component system of claim 15 , wherein the second RFID transponder is configured to communicate the identity information of the mating component to an RFID reader.
18. The component system of claim 1 , wherein the third IC is RFID-enabled and is coupled to a third antenna to provide a third RFID transponder;
wherein the second IC is configured to communicate the sensor data to the third RFID transponder.
19. The component system of claim 1 , wherein the IC is further configured to receive power from the one or more electrical leads on the mating component.
20. The component system of claim 1 , wherein the IC includes a communication bus interface and is configured to exchange information over a communication bus.
21. The component system of claim 1 , further comprising a display coupled to the IC, wherein the IC is configured to communicate information regarding the component to the display.
22. The component system of claim 21 , wherein the display is comprised from the group consisting of a light emitting diode (LED), an alpha display, a numeric display, an alphanumeric display, a liquid crystal display (LCD), and an electroluminescent display.
23. The component system of claim 1 , wherein the one or more sensors are comprised of one or more from the group consisting of a temperature sensor, a pressure sensor, a humidity sensor, a movement sensor, a proximity sensor, a voltage sensor, a current sensor, a power sensor, a mechanical strain sensor, an impact sensor, a biological sensor, a contact closure sensor, a shock sensor, an audible sensor, a stress sensor, a wavelength sensor, a signal strength sensor, a phase shift sensors, an impedance sensor, a shock sensor, an input voltage standing wave ratio (VSWR) sensor, a signal quality sensor, an orientation sensor, a light level sensor, a contact sensor, and a flow sensor.
24. The component system of claim 1 , further comprising equipment comprised from the group consisting of fiber optic equipment, electrical equipment, power equipment, computer equipment, vehicle equipment, aviation equipment, network equipment, storage equipment, routing equipment, and telephony equipment in which the mating component is included to which the component is configured to connect.
25. A method for determining the location of sensor data regarding a component, comprising:
sensing data relating to a component via one or more sensors;
communicating the sensor data from one or more sensors to an integrated circuit (IC); and
associating the sensor data with identity information of a mating component when one or more electrical leads coupled to the IC are connected to one or more electrical leads coupled to a second IC of the mating component;
sensing second data relating to the mating component via a second one or more sensors;
communicating the second sensor data to a third IC; and
communicating the second sensor data from the third IC to the second IC.
26. The method of claim 25 , wherein associating the sensor data comprises communicating the sensor data over the one or more electrical leads to the mating component to associate the sensor data with the identity information of the mating component.
27. The method of claim 25 , wherein associating the sensor data comprises receiving the identity information of the mating component over the one or more electrical leads to associate the sensor data with the identity information of the mating component.
28. The method of claim 25 , further comprising the IC communicating the sensor data via radio-frequency (RF) communications to an RFID reader.
29. The method of claim 25 , further comprising the IC communicating identity information of the mating component via radio-frequency (RF) communications to an RFID reader.