Apparatus and method for fabricating bonded substrate
A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.
1. A method for bonding two substrates held by first and second holding plates facing each other and arranged in a process chamber, wherein at least one of the first and second holding plates includes a chuck surface and a channel extending along the chuck surface, the method comprising:
chucking an outer surface of a selected one of the two substrates and holding the substrate in a horizontal state by a holding member while carrying the substrate in the process chamber;
housing the holding member in the channel extending along the chuck surface of the at least one of the first and second holding plates when transferring the substrate held by the holding member to the at least one of the first and second holding plates;
horizontally pulling back the holding member along the channel after execution of a transfer of the substrate to the at least one of the first and second holding plates from the holding member; and
bonding the two substrates held by the first and second holding plates to form a bonded substrate.
2. The method according to claim 1 , wherein the channel extends along a moving passage of the holding member.
3. A method for bonding two substrates held by first and second holding plates facing each other and arranged in a process chamber, wherein at least one of the first and second holding plates includes a chuck surface and a channel extending along the chuck surface, the method comprising:
chucking an outer surface of a selected one of the two substrates and holding the substrate in a horizontal state by a holding member;
placing the selected one of the substrates close to at least one of the first and second holding plates;
holding the selected one of the substrates by said at least one of the first and second holding plates while housing the holding member in the channel extending along the chuck surface of said at least one of the first and second holding plates;
horizontally pulling back the holding member along the channel after execution of a transfer of the substrate to the at least one of the first and second holding plates from the holding member; and
bonding the two substrates by the first and second holding plates to form a bonded substrate.
4. The method according to claim 3 , wherein the channel extends along a moving passage of the holding member.