IP Library › Granted Patent US 8,272,865
Granted Patent B2
US 8,272,865 · App. 12/934,463 · Granted Sep 25, 2012

Resin injection mold

Assignee: Panasonic Corporation
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Quick Facts
Patent No.
US 8,272,865
App. No.
12/934,463
Granted
Sep 25, 2012
Kind
B2
Abstract

Disclosed is a mold for resin injection molding that can realize rapid heating or cooling. A resin injection molding mold includes a cavity mold and a core mold and is produced on a base plate by metal photofabrication. The cavity mold is provided with a cavity warm water circuit for allowing warm water for heating to flow and a cavity cold water circuit for allowing cold water for cooling to flow. The core mold is also provided with a core warm water circuit and a core cold water circuit. The core mold includes an air blowing passage for feeding warm air or cold air into a resin molding part and a suction passage ( 36 ) for sucking a gas within the resin molding part. The resin molding part side of the air blowing passage and the suction passage is formed of a low-density shaping part that has a low metallic powder sintered density and is permeable to gas. Warm air or cold air can be blown through the low-density shaping part, whereby rapid heating or cooling of the resin injection molding mold can be realized.

Claims (29)

1. A resin injection mold for molding a resin, comprising:

a shaped part produced by metal stereolithography in which a light beam irradiates metal powder to sinter, or to melt and solidify the metal powder, wherein

the shaped part includes a plurality of low-density shaping parts having a small sintered density to allow gas to pass through the low-density shaping parts, and

a vent through which the gas, comprising a heated or a cooled gas, is sent to the low-density shaping parts, or through which the gas is sucked from the low-density shaping parts,

wherein the low-density shaping parts are each in contact with a resin molding part which molds a resin, and are connected to the vent, and

the gas is sent from the vent through the low-density shaping parts to the resin molding part, or the gas in the resin molding part is sucked through the low-density shaping parts into the vent.

2. The resin injection mold according to claim 1 , wherein the low-density shaping parts are provided on all surfaces of the shaped part which contact the resin molding part.

3. The resin injection mold according to claim 1 , wherein the small sintered density of the low-density shaping parts is greater than or equal to 70% and less than 95%.

4. The resin injection mold according to claim 1 , wherein an outer periphery of the shaped part includes a high-density shaped part having no air permeability.

5. The resin injection mold according to claim 4 , wherein the high-density shaped part has a metal powder sintered density of greater than or equal to 95%.

6. The resin injection mold according to claim 2 , wherein an outer periphery of the shaped part includes a high-density shaped part having no air permeability.

7. The resin injection mold according to claim 6 , wherein the high-density shaped part has a metal powder sintered density of greater than or equal to 95%.

8. The resin injection mold according to claim 3 , wherein an outer periphery of the shaped part includes a high-density shaped part having no air permeability.

9. The resin injection mold according to claim 8 , wherein the high-density shaped part has a metal powder sintered density of greater than or equal to 95%.

10. A resin injection mold for molding a resin, comprising:

a shaped part produced by metal stereolithography in which a light beam irradiates metal powder to sinter, or to melt and solidify the metal powder, wherein

the shaped part includes a plurality of low-density shaping parts having a small sintered density to allow gas to pass through the low-density shaping parts, and

a vent through which the gas, comprising a heated gas or a cooled gas, is sent to the low-density shaping parts, or through which the gas is sucked from the low-density shaping parts,

wherein the low-density shaping parts are each in contact with a resin molding part which molds a resin, at a position of the resin molding part where a non-infill of the resin is prone to form,

the resin molding part and the vent are connected to each other through the low-density shaping parts and an air blowing passage or a suction passage, and

the gas is sent from the vent through the air blowing passage and the low-density shaping parts to the resin molding part, or the gas in the resin molding part is sucked through the low-density shaping parts and the suction passage into the vent.

11. The resin injection mold according to claim 10 , wherein the low-density shaping parts are provided on all surfaces of the shaped part which contact the resin molding part.

12. The resin injection mold according to claim 10 , wherein the small sintered density of the low-density shaping parts is greater than or equal to 70% and less than 95%.

13. The resin injection mold according to claim 10 , wherein an outer periphery of the shaped part includes a high-density shaped part having no air permeability.

14. The resin injection mold according to claim 13 , wherein the high-density shaped part has a metal powder sintered density of greater than or equal to 95%.

15. The resin injection mold according to claim 11 , wherein an outer periphery of the shaped part includes a high-density shaped part having no air permeability.

16. The resin injection mold according to claim 15 , wherein the high-density shaped part has a metal powder sintered density of greater than or equal to 95%.

17. The resin injection mold according to claim 12 , wherein an outer periphery of the shaped part includes a high-density shaped part having no air permeability.

18. The resin injection mold according to claim 17 , wherein the high-density shaped part has a metal powder sintered density of greater than or equal to 95%.

Assignments (2)
MERGER Recorded Feb 13, 2012
From: PANASONIC ELECTRIC WORKS CO.,LTD.,
To: PANASONIC CORPORATION
Reel/Frame 027697/0525 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 5, 2010
From: HIGASHI, YOSHIKAZU; ABE, SATOSHI; FUWA, ISAO; TAKENAMI, MASATAKA; YOSHIDA, NORIO
To: PANASONIC ELECTRIC WORKS CO., LTD.
Reel/Frame 025326/0372 →
Priority Claims (1)
JP 2008-082165 · Mar 26, 2008 · national
Continuity (1)
Related Publication 20110045120A1 · Feb 24, 2011