Organosilicon compound and thermosetting resin composition containing the same

1. An organosilicon compound which is obtained by subjecting a compound (A), a compound (B) and a compound (C) to hydrosilylation reaction:

(A) silicone and/or silsesquioxane that has two or more Si—H groups per one molecule and has a molecular weight of 100 to 500,000;

(B) silicone and/or silsesquioxane that has two or more alkenyl groups per one molecule and has a molecular weight of 100 to 500,000, wherein at least one of the compound (A) and compound (B) is silsesquioxane; and

(C) a compound that has one or more epoxy or oxetanyl group and an alkenyl group having 2 to 18 carbon atoms per one molecule.

2. The organosilicon compound according to claim 1 , wherein

the compound (A) is at least one compound selected from the group consisting of compounds represented by the formulae (a-1) to (a-7);

the compound (B) is at least one compound selected from the group consisting of compounds represented by the formulae (b-1) and (b-2); and

the compound (C) is at least one compound selected from the group consisting of compounds represented by the formulae (c-1), (c-2) and (c-3):

wherein

in the formulae (a-1) to (a-7),

R represents a group selected independently from alkyl having 1 to 45 carbon atoms, cycloalkyl having 4 to 8 carbon atoms, aryl having 6 to 14 carbon atoms and arylalkyl having 7 to 24 carbon atoms, wherein

in the alkyl having 1 to 45 carbon atoms, arbitrary hydrogen may be replaced by fluorine, and arbitrary —CH 2 — may be replaced by —O— or —CH═CH—, provided that two —CH 2 — adjacent to each other are not simultaneously replaced;

in the benzene ring in the aryl and the arylalkyl, arbitrary hydrogen may be replaced by halogen or alkyl having 1 to 10 carbon atoms, and in the alkyl having from 1 to 10 carbon atoms, arbitrary hydrogen may be replaced by fluorine, and arbitrary —CH 2 — may be replaced by —O— or —CH═CH—, provided that two —CH 2 — adjacent to each other are not simultaneously replaced; and

the alkylene in the arylalkyl has 1 to 10 carbon atoms, in which in the alkylene, arbitrary —CH 2 — may be replaced by —O—, provided that two —CH 2 — adjacent to each other are not simultaneously replaced,

R 1 and R 2 each represent a group selected independently from alkyl having 1 to 4 carbon atoms, cyclopentyl, cyclohexyl and phenyl,

R 3 represents a group selected independently from alkyl having 1 to 4 carbon atoms, cyclopentyl, cyclohexyl and phenyl,

at least two of X represent hydrogen, and the remainder of X represents a group selected independently from alkyl having 1 to 4 carbon atoms, cyclopentyl, cyclohexyl and phenyl,

n represents an integer of 0 to 100, and

m represents an integer of 3 to 10,

wherein

in the formulae (b-1) and (b-2),

R and R 1 each have the same meaning as R and R 1 for the formulae (a-1) to (a-6), respectively,

R 4 represents a group selected independently from alkyl having 1 to 4 carbon atoms, cyclopentyl, cyclohexyl and phenyl,

Y represents a group selected independently from vinyl and allyl, and

n represents an integer of 0 to 100,

herein

in the formulae (c-1), (c-2) and (c-3),

one of R 5 and R 6 represents alkenyl having 2 to 10 carbon atoms in which one —CH 2 — may be replaced by —O— or 1,4-phenylene, and the other of R 5 and R 6 represents hydrogen or alkyl having 1 to 6 carbon atoms.

3. The organosilicon compound according to claim 2 , wherein the compound (B) is represented by the formula (b-1-1) or (b-2-1):

wherein R 4 represents a group selected independently from methyl and phenyl, and n represents an integer of 0 to 100.

4. The organosilicon compound according to claim 2 , wherein the compound (C) is at least one compound selected from the group consisting of compounds represented by the formulae (c-1-1), (c-2-1), (c-3-1) and (c-3-2):

5. A thermosetting resin composition comprising the organosilicon compound according to claim 1 , and a curing agent.

6. The thermosetting resin composition according to claim 5 , wherein the curing agent is an acid anhydride.

7. The thermosetting resin composition according to claim 5 , wherein the thermosetting resin composition further comprises a diluent, a curing accelerator and an additive.

8. The thermosetting resin composition according to claim 7 , wherein the diluent is an epoxy resin containing no silicon atom in a molecule thereof, an oxetane resin containing no silicon atom in a molecule thereof, or an organic solvent.

9. The thermosetting resin composition according to claim 7 , wherein the additive is an ultraviolet ray absorbent and/or an antioxidant.

10. A cured material which is obtained by heat-curing the thermosetting resin composition according to claim 5 .

11. A molded article which is obtained by molding the cured material according to claim 10 .

12. A coated film which is obtained by coating a film with the thermosetting resin composition according to claim 5 .

13. An organosilicon compound which is obtained by subjecting a compound (A), a compound (B) and a compound (C) to hydrosilylation reaction:

(A) silicone and/or silsesquioxane that has two or more Si—H groups per one molecule and has a molecular weight of 100 to 500,000, wherein the compound (A) is a silsesquioxane derivative represented by the formula (a-4-1):

(B) silicone and/or silsesquioxane that has two or more alkenyl groups per one molecule and has a molecular weight of 100 to 500,000, wherein the compound (B) is at least one compound selected from the group consisting of compounds represented by the formulae (b-1) and (b-2); and

(C) a compound that has one or more epoxy or oxetanyl group and an alkenyl group having 2 to 18 carbon atoms per one molecule, wherein the compound (C) is at least one compound selected from the group consisting of compounds represented by the formulae (c-1), (c-2) and (c-3):

wherein

in the formulae (b-1) and (b-2),

R represents a group selected independently from alkyl having 1 to 45 carbon atoms, cycloalkyl having 4 to 8 carbon atoms, aryl having 6 to 14 carbon atoms and arylalkyl having 7 to 24 carbon atoms, wherein

in the alkyl having 1 to 45 carbon atoms, arbitrary hydrogen may be replaced by fluorine, and arbitrary —CH 2 — may be replaced by —O— or —CH═CH—, provided that two —CH 2 — adjacent to each other are not simultaneously replaced;

in the benzene ring in the aryl and the arylalkyl, arbitrary hydrogen may be replaced by halogen or alkyl having 1 to 10 carbon atoms, and in the alkyl having from 1 to 10 carbon atoms, arbitrary hydrogen may be replaced by fluorine, and arbitrary —CH 2 — may be replaced by —O— or —CH═CH—, provided that two —CH 2 — adjacent to each other are not simultaneously replaced; and

the alkylene in the arylalkyl has 1 to 10 carbon atoms, in which in the alkylene, arbitrary —CH 2 — may be replaced by —O—, provided that two —CH 2 — adjacent to each other are not simultaneously replaced,

R 1 represents a group selected independently from alkyl having 1 to 4 carbon atoms, cyclopentyl, cyclohexyl and phenyl,

R 4 represents a group selected independently from alkyl having 1 to 4 carbon atoms, cyclopentyl, cyclohexyl and phenyl,

Y represents a group selected independently from vinyl and allyl, and

n represents an integer of 0 to 100, and

wherein

in the formulae (c-1), (c-2) and (c-3),

one of R 5 and R 6 represents alkenyl having 2 to 10 carbon atoms in which one —CH 2 — may be replaced by —O— or 1,4-phenylene, and the other of R 5 and R 6 represents hydrogen or alkyl having 1 to 6 carbon atoms.