Field effect transistor, logic circuit including the same and methods of manufacturing the same
Provided are a field effect transistor, a logic circuit including the same and methods of manufacturing the same. The field effect transistor may include an ambipolar layer that includes a source region, a drain region, and a channel region between the source region and the drain region, wherein the source region, the drain region, and the channel region may be formed in a monolithic structure, a gate electrode on the channel region, and an insulating layer separating the gate electrode from the ambipolar layer, wherein the source region and the drain region have a width greater than that of the channel region in a second direction that crosses a first direction in which the source region and the drain region are connected to each other.
1. A field effect transistor comprising:
an ambipolar layer including a source region, a drain region, and a channel region between the source region and the drain region, wherein the source region, the drain region, and the channel region are formed in a monolithic structure;
a gate electrode on the channel region; and
an insulating layer separating the gate electrode from the ambipolar layer,
wherein the source region and the drain region have a width greater than that of the channel region in a second direction that crosses a first direction in which the source region and the drain region are connected to each other, and
wherein the gate electrode is a single gate electrode formed closer to the source region than the drain region so that the field effect transistor is of an n type.
2. The field effect transistor of claim 1 , wherein the channel region has a width of about 5 nm to about 100 nm.
3. The field effect transistor of claim 1 , wherein the ambipolar layer is a single layer.
4. The field effect transistor of claim 1 , wherein the ambipolar layer is formed of a material selected from the group consisting of boron nitride, cadmium telluride, and niobium selenide.
5. The field effect transistor of claim 1 , wherein the ambipolar layer includes about 1 to about 9 layers of graphene.
6. The field effect transistor of claim 1 , further comprising:
a substrate, wherein the insulating layer is formed on the substrate and the ambipolar layer is formed on the insulating layer.
7. The field effect transistor of claim 1 , further comprising:
a substrate, wherein the gate electrode is formed between the substrate and the insulating layer.
8. The field effect transistor of claim 1 , wherein the second direction perpendicularly crosses the first direction.
9. A logic circuit comprising at least one p type transistor and at least one n type transistor, wherein the at least one n type transistor is the field effect transistor according to claim 1 .
10. A field effect transistor comprising:
an ambipolar layer including a source region, a drain region, and a channel region between the source region and the drain region, wherein the source region, the drain region, and the channel region are formed in a monolithic structure;
a gate electrode on the channel region; and
an insulating layer separating the gate electrode from the ambipolar layer,
wherein the source region and the drain region have a width greater than that of the channel region in a second direction that crosses a first direction in which the source region and the drain region are connected to each other, and
wherein the gate electrode is a single gate electrode formed closer to the drain region than the source region so that the field effect transistor is of a p type.
11. The field effect transistor of claim 10 , wherein the channel region has a width of about 5 nm to about 100 nm.
12. The field effect transistor of claim 10 , wherein the ambipolar layer is a single layer.
13. The field effect transistor of claim 10 , wherein the ambipolar layer is formed of a material selected from, the group consisting of boron nitride, cadmium telluride, and niobium selenide.
14. The field effect transistor of claim 10 , wherein the ambipolar layer includes about 1 to about 9 layers of graphene.
15. The field effect transistor of claim 10 , further comprising:
a substrate, wherein the insulating layer is formed on the substrate and the ambipolar layer is formed on the insulating layer.
16. The field effect transistor of claim 10 , further comprising:
a substrate, wherein the gate electrode is formed between the substrate and the insulating layer.
17. The field effect transistor of claim 10 , wherein the second direction perpendicularly crosses the first direction.
18. A logic circuit comprising at least one p type transistor and at least one n type transistor, wherein the at least one n type transistor is the field effect transistor according to claim 10 .
19. A field effect transistor comprising:
an ambipolar layer including a source region, a drain region, and a channel region between the source region and the drain region, wherein the source region, the drain region, and the channel region are formed in a monolithic structure:
a gate electrode on the channel region; and
an insulating layer separating the gate electrode from the ambipolar layer,
wherein the source region and the drain region have a width greater than that of the channel region in a second direction that crosses a first direction in which the source region and the drain region are connected to each other,
wherein the gate electrode includes first and second gate electrodes formed above the channel region, the first gate electrode formed closer to the source region than the drain region and the second gate electrode formed closer to the drain region than the source region, and
wherein when a voltage is selectively applied to the first gate electrode or the second gate electrode, the field effect transistor is of an n type or of a p type, respectively.