Semiconductor device package having a buffer structure and method of fabricating the same
A semiconductor device package and a method of fabricating the same are disclosed. The semiconductor device package includes a substrate, a buffer structure, two active chips and a bridge chip. The substrate has a cavity, a first surface and a second surface opposite to the first surface. The cavity is extended from the first surface toward the second surface, and the buffer structure is disposed in the cavity. The active chips are disposed on and electrically connected to the first surface and around the cavity. The active chips both have a first active surface. The bridge chip is disposed in the cavity and above the buffer structure. The bridge chip has a second active surface, the second active surface faces the first active surfaces and is partially overlapped with the first active surfaces, the bridge chip is used for providing a proximity communication between the active chips.
1. A semiconductor device package, comprising:
a substrate having a cavity, a first surface and a second surface opposite to the first surface, wherein the cavity is extended from the first surface toward the second surface;
a buffer structure disposed in the cavity, wherein the buffer structure comprises a vesicant material;
two active chips mechanically disposed on and electrically connected to the first surface and around the cavity, wherein the active chips both have a first active surface; and
a bridge chip disposed in the cavity and above the buffer structure, wherein the bridge chip has a second active surface, the second active surface faces the first active surfaces and is partially overlapped with the first active surfaces, the bridge chip is used for providing a proximity communication between the two active chips.
2. The semiconductor device package according to claim 1 , wherein the vesicant material is a thermosetting material.
3. The semiconductor device package according to claim 1 , wherein the buffer structure comprises a plurality of knobs.
4. The semiconductor device package according to claim 1 , further comprising two adhesion layers disposed between the active chips and the bridge chip respectively.
5. The semiconductor device package according to claim 1 , further comprising two adhesion layers disposed between the active chips and the first surface respectively.
6. The semiconductor device package according to claim 1 , further comprising a plurality of solder bumps disposed between the active chips and the first surface.
7. The semiconductor device package according to claim 1 , wherein the active chips each comprise a first signal pad disposed on the first active surface, the bridge chip comprises two second signal pads disposed on the second active surface and in accordance with the first signal pads for capacitively or inductively coupling to the first signal pads.
8. A semiconductor device package, comprising:
a substrate having a first surface and a second surface opposite to the first surface;
a buffer structure disposed on the first surface;
two pillar sets disposed on two sides of the buffer structure respectively, wherein each pillar set has a plurality of pillars;
two active chips disposed on the pillar sets and electrically connected to the first surface, wherein the active chips both have a first active surface; and
a bridge chip disposed on the buffer structure and below the active chips, wherein the bridge chip has a second active surface, the second active surface faces the first active surfaces and is partially overlapped with the first active surfaces, the bridge chip is used for providing a proximity communication between the two active chips.
9. The semiconductor device package according to claim 8 , further comprising an underfill disposed between the pillar sets and the substrate.
10. The semiconductor device package according to claim 8 , wherein the buffer structure comprises a vesicant material.
11. The semiconductor device package according to claim 10 , wherein the vesicant material is a thermosetting material.
12. The semiconductor device package according to claim 8 , wherein the buffer structure comprises a plurality of knobs.
13. The semiconductor device package according to claim 8 , further comprising two adhesion layers disposed between the active chips and the bridge chip respectively.
14. The semiconductor device package according to claim 8 , wherein the active chips each comprise a first signal pad disposed on the first active surface, the bridge chip comprises two second signal pads disposed on the second active surface and in accordance with the first signal pads for capacitively or inductively coupling to the first signal pads.