IP Library Granted Patent US 8,284,117
Granted Patent B2
US 8,284,117 · App. 12/644,753 · Granted Oct 9, 2012

Antenna device and method of manufacturing the same

Assignee: Samsung Electronics Co., Ltd
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Quick Facts
Patent No.
US 8,284,117
App. No.
12/644,753
Granted
Oct 9, 2012
Kind
B2
Abstract

A signal transmitting/receiving antenna device for Radio Frequency Identification (RFID) which executes contactless data communication, and a method of manufacturing the same. The antenna device includes an antenna module including a dielectric film substrate, an antenna pattern which is a conductive pattern printed on the top and bottom sides of the dielectric film substrate, the top and bottom antenna pattern parts being connected to each other through one or more via holes extending through the dielectric film substrate, and top and bottom passivation layers formed on the dielectric film substrate to cover the top and bottom antenna pattern parts; and a radio wave absorbent printed on one of the top and bottom passivation layers of the antenna module.

Claims (19)

1. A signal transmitting/receiving antenna device for Radio Frequency Identification (RFID) which executes contactless data communication, the antenna device comprising:

an antenna module, comprising:

a dielectric film substrate having a top side and a bottom side;

an antenna pattern, formed from conductive material, printed on the top and bottom sides of the dielectric film substrate, forming a top antenna pattern part and a bottom antenna pattern part, the top and bottom antenna pattern parts connected to each other through one or more holes extending through the dielectric film substrate; and

top and bottom passivation layers formed on the dielectric film substrate to cover the top and bottom antenna pattern parts; and

a radio wave absorbent printed on one of the top and bottom passivation layers of the antenna module.

2. The antenna device as claimed in claim 1 , wherein the dielectric film substrate is formed from a thermoplastic resin formed from at least one of polyimide, polyethylene terephthalate, polyethylene naphthalate (PEN), and polyvinyl chloride (PVC).

3. The antenna device as claimed in claim 1 , wherein the antenna pattern has a loop shape.

4. The antenna device as claimed in claim 1 , wherein the radio wave absorbent is an iron/nickel (Fe/Ni) and resin composition.

5. A method for manufacturing an antenna device, comprising the steps of:

forming a first conductive pattern on the bottom side of a dielectric film substrate by printing conductive paste;

forming one or more holes through the conductive film substrate;

forming a second conductive pattern on the top side of the conductive film substrate by printing conductive paste;

forming a first passivation layer on the first conductive pattern;

forming a second passivation layer on the second conductive pattern; and

printing a radio wave absorbent layer on one of the first and second passivation layers.

6. The method as claimed in claim 5 , wherein the radio wave absorbent is an iron/nickel (Fe/Ni) and resin composition.

7. The method as claimed in claim 6 , wherein the radio wave absorbent has a viscosity in the range of about 20,000 to 70,000 cps.

8. The method as claimed in claim 5 , wherein the radio wave absorbent has a viscosity in the range of about 20,000 to 70,000 cps.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 29, 2009
From: KIM, KI-HYUN; KANG, SEOK-MYONG; PARK, SE-HO; LEE, WOO-RAM
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 023711/0398 →
Priority Claims (1)
KR 10-2008-0131193 · Dec 22, 2008 · national
Continuity (1)
Related Publication 20100156749A1 · Jun 24, 2010