IP Library Granted Patent US 8,290,753
Granted Patent B2
US 8,290,753 · App. 11/724,044 · Granted Oct 16, 2012

Materials-based failure analysis in design of electronic devices, and prediction of operating life

Assignee: Vextec Corporation
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Quick Facts
Patent No.
US 8,290,753
App. No.
11/724,044
Granted
Oct 16, 2012
Kind
B2
Abstract

The technology includes methods, a system, and a computer readable medium for predicting the time to failure of an electronic component, by generating a finite element model of the component, developing a microstructure-based failure model for each representative volume element associated with each node in the finite element model, and calculating a time to failure of the component from the shortest predicted time to failure of any node when a value of a stress variable is applied to the microstructure-based failure model of each node. The technology further includes methods, system, and a medium programmed to predict failure of a system that includes an electronic component, based on predicting time to failure of the component.

Claims (32)

1. A method of predicting time to failure of a metallic component of an electronic device, the method comprising:

generating a finite element model of the component, wherein the finite element model comprises a plurality of nodes, and wherein a value of at least one stress variable is associated with each node of the plurality of nodes;

defining at least one representative volume element for each node of the plurality of nodes;

developing a microstructure-based failure model for each of the representative volume elements, wherein the microstructure-based failure model uses random initial values for one or more properties of a material microstructure within each of the representative volume elements, and wherein the microstructure-based failure model represents heterogeneous microstructures in the component, and comprises one or more cyclic fatigue models selected from a first group consisting of crack nucleation, short crack growth, and long crack growth models, and further comprises one or more time-dependent fatigue models selected from a second group consisting of crack nucleation, short crack growth, and long crack growth models;

simulating failure of each node by applying the value of the at least one stress variable for that node to the microstructure-based failure model for each of the representative volume elements for that node, thereby calculating a predicted time to failure for each representative volume element; and

calculating a time to failure for the component by choosing the shortest predicted time to failure for any node.

2. The method of claim 1 , further comprising:

performing the simulating of failure for each node a plurality of times, using different initial values for the one or more properties of the material microstructure, thereby producing a plurality of predicted times to failure for the component; and

deriving a probabilistic model of failure of the component based on the plurality of predicted times to failure.

3. The method of claim 1 , wherein one or more of the crack nucleation and short crack growth models further comprises a phase coarsening model.

4. A computer system, configured to predict time to failure of a metallic component of an electronic device, the system comprising:

a memory; and

a processor, wherein the processor is configured to execute instructions stored in the memory for:

generating a finite element model of the component, wherein the finite element model comprises a plurality of nodes, and wherein a value of at least one stress variable is associated with each node of the plurality of nodes;

defining at least one representative volume element for each node of the plurality of nodes;

developing a microstructure-based failure model for each of the representative volume elements, wherein the microstructure-based failure model uses random initial values for one or more properties of a material microstructure within each of the representative volume elements, and wherein the microstructure-based failure model represents heterogeneous microstructures in the component, and comprises one or more cyclic fatigue models selected from a first group consisting of crack nucleation, short crack growth, and long crack growth models, and further comprises one or more time-dependent fatigue models selected from a second group consisting of crack nucleation, short crack growth, and long crack growth models;

simulating failure of each node by applying the value of the at least one stress variable for that node to the microstructure-based failure model for each of the representative volume elements for that node, thereby calculating a predicted time to failure for each representative volume element; and

calculating a time to failure for the component by choosing the shortest predicted time to failure for any node.

5. The system of claim 4 , wherein the processor is further configured to execute instructions comprising:

performing the simulating of failure for each node a plurality of times, using different initial values for the one or more properties of the material microstructure, thereby producing a plurality of predicted times to failure for the component; and

deriving a probabilistic model of failure of the component based on the plurality of predicted times to failure.

6. The system of claim 4 , wherein one or more of the crack nucleation and short crack growth models further comprises a phase coarsening model.

7. A computer readable non-transitory medium, storing instructions for predicting time to failure of an electronic component, the instructions, when executed by a processor, cause the processor to perform operations comprising:

generating a finite element model of the component, wherein the finite element model comprises a plurality of nodes, and wherein a value of at least one stress variable is associated with each node of the plurality of nodes;

defining at least one representative volume element for each node of the plurality of nodes;

developing a microstructure-based failure model for each of the representative volume elements, wherein the microstructure-based failure model uses random initial values for one or more properties of a material microstructure within each of the representative volume elements, and wherein the microstructure-based failure model represents heterogeneous microstructures in the component, and comprises one or more cyclic fatigue models selected from a first group consisting of crack nucleation, short crack growth, and long crack growth models, and further comprises one or more time-dependent fatigue models selected from a second group consisting of crack nucleation, short crack growth, and long crack growth models;

simulating failure of each node by applying the value of the at least one stress variable for that node to the microstructure-based failure model for each of the representative volume elements for that node, thereby calculating a predicted time to failure for each representative volume element; and

calculating a time to failure for the component by choosing the shortest predicted time to failure for any node.

8. The computer readable medium of claim 7 , wherein the medium is further encoded with instructions to:

perform the simulating of failure for each node a plurality of times, using different initial values for the one or more properties of the material microstructure, thereby producing a plurality of predicted times to failure for the component; and

derive a probabilistic model of failure of the component based on the plurality of predicted times to failure.

9. The medium of claim 7 , wherein one or more of the crack nucleation and short crack growth models further comprises a phase coarsening model.

Assignments (2)
CONFIRMATORY LICENSE Recorded Sep 28, 2016
From: VEXTEC CORPORATION
To: NAVY, DEPARTMENT OF THE
Reel/Frame 040174/0186 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 18, 2007
From: TRYON, ROBERT G.; DEY, ANIMESH; NASSER, LOREN A.; KRISHNAN, GANAPATHI
To: VEXTEC CORPORATION
Reel/Frame 019844/0583 →
Continuity (4)
Continuation In Part 11698262 · Jan 24, 2007
Provisional Application 60761958 · Jan 24, 2006
Provisional Application 60778196 · Mar 1, 2006
Related Publication 20080015827A1 · Jan 17, 2008