Sacrificial layers made from aerogel for microelectromechanical systems (MEMS) device fabrication processes

1. A method for processing sacrificial layers in MEMS device fabrication, the method comprising:

applying a patterned layer of Aerogel material onto a substrate to form an Aerogel sacrificial layer;

applying at least one non-sacrificial silicon layer over the Aerogel sacrificial layer, wherein the non-sacrificial silicon layer is coupled to the substrate through one or more gaps provided in the patterned layer of Aerogel material; and

removing the Aerogel sacrificial layer by exposing the Aerogel sacrificial layer to a removal liquid;

applying a protection layer to one or more exposed regions of the Aerogel sacrificial layer.

2. The method of claim 1 , wherein the substrate includes indented regions that are layered with the Aerogel material when the patterned layer of Aerogel material is applied.

3. The method of claim 1 , wherein the substrate comprise a combination of non-sacrificial material and a previously applied sacrificial layer of Aerogel material.

4. The method of claim 1 , wherein the protection layer is applied prior to applying the at least one non-sacrificial silicon layer over the Aerogel sacrificial layer.

5. The method of claim 1 , wherein the protection layer is applied after applying the at least one non-sacrificial silicon layer over the Aerogel sacrificial layer.

6. The method of claim 1 , wherein removing the Aerogel sacrificial layer further comprises breaching the protection layer to allow the removal liquid to reach the Aerogel sacrificial layer.

7. The method of claim 1 , wherein removing the Aerogel sacrificial layer by exposing the Aerogel sacrificial layer to a removal liquid further comprises:

exposing the Aerogel sacrificial layer to a chemical etchant that dissolves the Aerogel material.

8. The method of claim 7 , wherein the chemical etchant comprises one of a Hydrofluoric acid, a phosphoric acid or an organic solvent.

9. The method of claim 7 , further comprising removing dissolved waste products.

10. The method of claim 1 , wherein removing the Aerogel sacrificial layer by exposing the Aerogel sacrificial layer to a removal liquid further comprises:

exposing the Aerogel sacrificial layer to an inert chemical that collapses the Aerogel material.

11. The method of claim 10 , wherein the inert chemical comprises at least one of an alcohol, an acetone, or water.

12. A method for fabrication MEMS devices with at least one open void defined within, the method comprising:

fabricating a structure for a MEMS device having a plurality of non-sacrificial material layers and at least one Aerogel sacrificial layer made from an Aerogel material, wherein the at least one Aerogel sacrificial layer made from an Aerogel material occupies a volume within the structure defining where a void is to be located within the MEMS device;

removing the Aerogel sacrificial layer by exposing the Aerogel material to a removal liquid;

wherein fabricating the structure for the MEMS device further comprises:

applying a patterned layer of Aerogel material onto a substrate to form the Aerogel sacrificial layer;

applying at least one non-sacrificial silicon layer over the Aerogel sacrificial layer;

wherein the non-sacrificial silicon layer is coupled to the substrate through one or more gaps provided in the patterned layer of Aerogel material; and

applying a protection layer to one or more exposed regions of the Aerogel sacrificial layer.

13. The method of claim 12 , wherein the substrate includes indented regions that are layered with the Aerogel material when the patterned layer of Aerogel material is applied.

14. The method of claim 12 , wherein the substrate comprise a combination of non-sacrificial material and a previously applied sacrificial layer of Aerogel material.

15. The method of claim 12 , wherein removing the Aerogel sacrificial layer by exposing the Aerogel material to a removal liquid further comprises one of:

exposing the Aerogel sacrificial layer to a chemical etchant that dissolves the Aerogel material; or

exposing the Aerogel sacrificial layer to an inert chemical that collapses the Aerogel material.

16. The method of claim 15 , wherein the chemical etchant comprises one of a Hydrofluoric acid, a phosphoric acid or an organic solvent.

17. The method of claim 15 , wherein the inert chemical comprises at least one of an alcohol, an acetone, or water.