IP Library Granted Patent US 8,294,534
Granted Patent B2
US 8,294,534 · App. 12/888,185 · Granted Oct 23, 2012

Resonator

Assignee: NXP B.V.
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,294,534
App. No.
12/888,185
Granted
Oct 23, 2012
Kind
B2
Abstract

A resonator comprising a beam formed from a first material having a first Young's modulus and a first temperature coefficient of the first Young's modulus, and a second material having a second Young's modulus and a second temperature coefficient of the second Young's modulus, a sign of the second temperature coefficient being opposite to a sign of the first temperature coefficient at least within operating conditions of the resonator, wherein the ratio of the cross sectional area of the first material to the cross sectional area of the second material varies along the length of the beam, the cross sectional areas being measured substantially perpendicularly to the beam.

Claims (18)

1. A resonator comprising a beam formed from a first material having a first Young's modulus and a first temperature coefficient of the first Young's modulus, and a second material having a second Young's modulus and a second temperature coefficient of the second Young's modulus, a sign of the second temperature coefficient being opposite to a sign of the first temperature coefficient at least within operating conditions of the resonator, wherein the second material forms a layer on the first material, and wherein the ratio of the cross sectional area of the first material to the cross sectional area of the second material varies along the length of the beam, the cross sectional areas being measured substantially perpendicularly to the beam.

2. A resonator according to claim 1 comprising a MEMS resonator wherein the first material comprises silicon.

3. A resonator according to claim 1 wherein the second material comprises silicon dioxide.

4. A resonator according to claim 1 further comprising an anchor, the beam having a tip spaced apart from the anchor.

5. A resonator according to claim 4 wherein the thickness of the second material is greater at or near the anchor.

6. A resonator according to claim 1 wherein the thickness of the first material is substantially constant along the length of the beam, and the thickness of the second material varies along the length of the beam.

7. A resonator according to claim 1 comprising a plurality of slits formed in the beam and extending longitudinally along at least part of the length of the beam.

8. A resonator according to claim 1 wherein the beam comprises a top surface and an opposite bottom surface and two opposite side walls, and wherein the second material forms a skin around the top, bottom and side walls of the beam, the thickness of the second material over the side walls being greater than the thickness of the second material over the top and bottom surfaces of the beam.

9. A resonator according to claim 1 wherein the first material is doped, and the level of doping varies along the length of the beam.

10. A method of manufacturing a MEMS resonator comprising the steps of:

forming a beam from a first material;

coating the beam with a second material;

such that the ratio of the cross-sectional area of the first material to the cross-sectional area of the second material varies along the length of the beam.

11. A method according to claim 10 wherein the ratio of the cross-sectional area of the first material to the cross-sectional area of the second material is varied by varying the rate at which the second material is coated onto the first material.

12. A method according to claim 11 wherein the ratio of the cross-sectional area of the first material to the cross-sectional area of the second material is varied by forming the beam from a first material having a cross-sectional area that varies along the length of the beam.

13. A method of manufacturing a MEMS resonator according to any one of claim 10 comprising the steps of forming the beam from a silicon substrate and coating the silicon substrate with a silicon oxide layer.

14. A method according to claim 13 wherein prior to the step of coating the beam with silicon dioxide the following further step is carried out:

implanting the silicon substrate with an impurity such that the concentration of the impurity varies along the length of the beam.

Assignments (10)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 12, 2012
From: AVOORT, CAS VAN DER; VAN BEEK, JOZEF THOMAS MARTINUS; VAN WINGERDEN, JOHANNES; BONTEMPS, JOEP; LANDER, ROBERT JAMES POSCOE
To: NXP B.V.
Reel/Frame 027522/0867 →
Priority Claims (1)
EP 09252251 · Sep 22, 2009 · regional
Continuity (1)
Related Publication 20110127625A1 · Jun 2, 2011