IP Library Granted Patent US 8,298,367
Granted Patent B2
US 8,298,367 · App. 11/921,283 · Granted Oct 30, 2012

Pressure sensitive adhesives and methods for their preparation

Assignee: Dow Corning Corporation
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Quick Facts
Patent No.
US 8,298,367
App. No.
11/921,283
Granted
Oct 30, 2012
Kind
B2
Abstract

A pressure sensitive adhesive composition includes (A) a bodied MQ resin containing (i) a resinous core and (ii) a nonresinous polyorganosiloxane group, where the nonresinous polyorganosiloxane group is terminated with a silicon-bonded hydroxyl group; (B) a treated MQ resin, where (B)/(A) ratio has a value of 0.3 to 5.0, and (C) a polydiorganosiloxane terminated with a condensation reactable group; where resin/polymer ratio has a value of 2.0 to 3.0; optionally (D) a crosslinker; optionally (E) a catalyst; and optionally (F) a solvent. A pressure sensitive adhesive product prepared by curing the pressure sensitive adhesive composition is useful in structural attachment applications such as structural glazing applications.

Claims (41)

1. A pressure sensitive adhesive composition comprising:

(A) a bodied MQ resin comprising

(i) a resinous core and

(ii) a nonresinous polyorganosiloxane group, where the nonresinous polyorganosiloxane group is terminated with a silicon-bonded hydroxyl group;

(B) a treated MQ resin comprising a trimethylsilyl-terminated MQ resin, where (B)/(A) ratio has a value of 0.3 to 5.0, and

(C) a polydiorganosiloxane terminated with a condensation reactable group;

where resin/polymer ratio has a value of 2.0 to 3.0;

optionally (D) a crosslinker;

optionally (E) a catalyst; and

optionally (F) a solvent.

2. The pressure sensitive adhesive composition of claim 1 , where component (A)(ii) is a hydroxy-terminated polydimethylsiloxane group.

3. The pressure sensitive adhesive composition of claim 1 , where component (C) is an alkoxysilylhydrocarbylene-endblocked polydiorganosiloxane.

4. The pressure sensitive adhesive composition of claim 1 , where component (C) has formula: (R 5 ) 3-y R 4 y SiO—(R 4 2 SiO) x —SiR 4 y (R 5 ) 3-y , where each R 4 is independently a substituted or unsubstituted monovalent hydrocarbon group, each R 5 independently comprises a halogen atom, an acetamido group, an acetoxy group, an acyloxy group, an alkoxy group, an amido group, an amino group, an aminoxy group, a hydroxyl group, an oximo group, a ketoximo group, a methylacetamido group, or an alkoxysilylhydrocarbylene group, x is an integer having a value of 200 to 1,000 and y is 0, 1, or 2.

5. The pressure sensitive adhesive composition of claim 4 , where each R 4 is an alkyl group, each R 5 is a hydroxyl group or a trialkoxysilethylene group, x is 500 to 700; and y is 0.

6. The pressure sensitive adhesive composition of claim 1 , where component (D) is present and is a trialkoxysilane.

7. The pressure sensitive adhesive composition of claim 1 , where component (E) is present and is a titanium catalyst.

8. The pressure sensitive adhesive composition of claim 1 , where component (F) is present and is a hydrocarbon liquid.

9. A kit comprising:

(I) the composition of claim 1 , and

(II) a support.

10. A method comprising:

(1) applying to opposing sides of a support a composition comprising;

(A) a bodied MQ resin comprising

(i) a resinous core and

(ii) a nonresinous polyorganosiloxane group where the nonresinous polyorganosiloxane group is terminated with a silicon-bonded hydroxyl group;

(B) a treated MQ resin comprising a trimethylsilyl-terminated MQ resin, where (B)/(A) ratio has a value of 0.3 to 5.0, and

(C) a polydiorganosiloxane terminated with a condensation reactable group;

where resin/polymer ratio has a value of 2.0 to 3.0;

optionally (D) a crosslinker;

optionally (E) a catalyst; and

optionally (F) a solvent;

optionally (2) removing component (F),

where the composition is applied on each opposing side in an amount sufficient to provide on each opposing side a layer having a thickness of at least 3 mils after removal of component (F).

11. A pressure sensitive adhesive tape prepared by the method of claim 10 .

12. The pressure sensitive adhesive tape of claim 11 , where the support is a silicone elastomer having a durometer hardness of 25 to 70.

13. The method of claim 10 , further comprising:

(3) interposing the product of step (2) between surfaces,

(4) applying pressure to the product of step (2),

(5) curing the layers.

14. The pressure sensitive adhesive composition of claim 1 , where component (B) has a weight average molecular weight of 3,000 to 40,000.

15. The method of claim 10 , where component (B) has a weight average molecular weight of 3,000 to 40,000.

Continuity (2)
Provisional Application 60701766 · Jul 19, 2005
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