Resistance-change memory cell array
According to one embodiment, a resistance-change memory cell array in which a plurality of horizontal electrodes extending horizontally and a plurality of vertical electrodes extending vertically are arranged to configure a cross-point structure includes rectifying insulating films formed in contact with side surfaces of the vertical electrodes in facing regions between the horizontal electrodes and the vertical electrodes, variable resistance films formed in contact with side surfaces of the horizontal electrodes in the facing regions between the horizontal electrodes and the vertical electrodes, and conductive layers formed between the rectifying insulating films and the variable resistance films.
1. A resistance-change memory cell array in which a plurality of horizontal electrodes extending horizontally and a plurality of vertical electrodes extending vertically are arranged to configure a cross-point structure, comprising:
rectifying insulating films formed in contact with side surfaces of the vertical electrodes in respective facing regions between the horizontal electrodes and the vertical electrodes,
variable resistance films formed in contact with side surfaces of the horizontal electrodes in the facing regions between the horizontal electrodes and the vertical electrodes, and
conductive layers formed between the rectifying insulating films and the variable resistance films.
2. The memory cell array according to claim 1 , wherein an area of the rectifying insulating film in a direction perpendicular to a facing direction of the horizontal electrodes and the vertical electrodes is smaller than an area of the variable resistance film in a direction perpendicular to the facing direction.
3. The memory cell array according to claim 1 , wherein the rectifying insulating film is formed to cover a peripheral side surface of the vertical electrode, the conductive layer is formed to cover a peripheral side surface of the rectifying insulating film and the variable resistance film is formed to cover a peripheral side surface of the conductive layer and has a portion formed in contact with the side surface of the horizontal electrode.
4. The memory cell array according to claim 3 , wherein the conductive layer is divided in a region between the horizontal electrodes adjacent in the horizontal direction.
5. The memory cell array according to claim 3 , wherein the conductive layer is divided in a region between the vertical electrodes adjacent in the vertical direction.
6. The memory cell array according to claim 1 , wherein a concave portion containing an area that faces the vertical electrode and is larger than the area is formed in a surface portion of the horizontal electrode that faces the vertical electrode.
7. The memory cell array according to claim 1 , wherein the side surface of the horizontal electrode is a concave curved surface and the side surface of the vertical electrode is a convex curved surface in the facing region between the horizontal electrodes and the vertical electrodes.
8. The memory cell array according to claim 1 , wherein respective adjacent arrays of the vertical electrodes along an extending direction of the horizontal electrode are shifted by a half pitch.
9. A resistance-change memory cell array in which a plurality of horizontal electrodes extending horizontally and a plurality of vertical electrodes extending vertically are arranged to configure a cross-point structure, comprising:
variable resistance films formed in contact with side surfaces of the vertical electrodes in respective facing regions between the horizontal electrodes and the vertical electrodes,
rectifying insulating films formed in contact with side surfaces of the horizontal electrodes in the facing regions between the horizontal electrodes and the vertical electrodes, and
conductive layers formed between the variable resistance films and the rectifying insulating films.
10. The memory cell array according to claim 9 , wherein an area of the variable resistance film in a direction perpendicular to a facing direction of the horizontal electrodes and the vertical electrodes is smaller than an area of the rectifying insulating film in a direction perpendicular to the facing direction.
11. The memory cell array according to claim 9 , wherein the variable resistance film is formed to cover a peripheral side surface of the vertical electrode, the conductive layer is formed to cover a peripheral side surface of the variable resistance film and the rectifying insulating film is formed to cover a peripheral side surface of the conductive layer and has a portion formed in contact with the side surface of the horizontal electrode.
12. The memory cell array according to claim 11 , wherein the conductive layer is divided in a region between the horizontal electrodes adjacent in the horizontal direction.
13. The memory cell array according to claim 11 , wherein the conductive layer is divided in a region between the vertical electrodes adjacent in the vertical direction.
14. The memory cell array according to claim 9 , wherein a concave portion containing an area that faces the vertical electrode and is larger than the area is formed in a surface portion of the horizontal electrode that faces the vertical electrode.
15. The memory cell array according to claim 9 , wherein a side surface of the horizontal electrode is a concave curved surface and a side surface of the vertical electrode is a convex curved surface in the facing region between the horizontal electrodes and the vertical electrodes.
16. The memory cell array according to claim 9 , wherein respective adjacent arrays of the vertical electrodes formed along an extending direction of the horizontal electrode are shifted by a half pitch.
17. A resistance-change memory cell array in which a plurality of horizontal electrodes extending horizontally and a plurality of vertical electrodes extending vertically are arranged to configure a cross-point structure, comprising:
rectifying insulating films formed in contact with side surfaces of one of the horizontal electrodes and vertical electrodes in facing regions between the respective electrodes, and
variable resistance films formed in contact with side surfaces of the other electrodes of the horizontal electrodes and vertical electrodes in the facing regions between the respective electrodes and formed in contact with the rectifying insulating films,
wherein an area of the rectifying insulating film in a direction perpendicular to a facing direction of the above electrodes is smaller than an area of the variable resistance film in a direction perpendicular to the facing direction.
18. The memory cell array according to claim 17 , wherein the rectifying insulating film is formed to cover a peripheral side surface of the vertical electrode, and the variable resistance film is formed to cover a peripheral side surface of the rectifying insulating film and has a portion formed in contact with the side surface of the horizontal electrode.
19. The memory cell array according to claim 17 , wherein a concave portion containing an area that faces the vertical electrode and is larger than the area is formed in a surface portion of the horizontal electrode that faces the vertical electrode.
20. The memory cell array according to claim 17 , wherein a side surface of the horizontal electrode is a concave curved surface and a side surface of the vertical electrode is a convex curved surface in the facing region between the horizontal electrodes and the vertical electrodes.