Electromagnetic interference suppressing device and related electronic device
An electromagnetic interference suppressing device includes a plurality of signal guiding units coupled to a metal housing of an electronic component for receiving a plurality of signals transmitted from the metal housing (the electronic component is installed on a circuit board), a plurality of grounding units coupled to a plurality of ground pads of the circuit board for transmitting the plurality of signals to the plurality of ground pads, and a main body coupled to the plurality of signal guiding units and the plurality of grounding units for transmitting the plurality of signals between the plurality of signal guiding units and the plurality of grounding units so as to implement a return path.
1. An electromagnetic interference suppressing device, comprising:
a plurality of signal guiding units coupled to a metal housing of an electronic component for receiving a plurality of signals transmitted from the metal housing, wherein the electronic component is installed on a circuit board;
a plurality of grounding units coupled to a plurality of ground pads of the circuit board for transmitting the plurality of signals to the plurality of ground pads; and
a main body coupled to the plurality of signal guiding units and the plurality of grounding units for transmitting the plurality of signals between the plurality of signal guiding units and the plurality of grounding units so as to implement a return path;
wherein power of electromagnetic interference corresponding to the plurality of signals is substantially less than 34 dB-microvolts per meter when frequency bands of the plurality of signals are between 30 megahertz and 224 megahertz and the power of electromagnetic interference corresponding to the plurality of signals is substantially less than 41 dB-microvolts per meter when the frequency bands of the plurality of signals are between 224 megahertz and 1 gigahertz.
2. The electromagnetic interference suppressing device of claim 1 , wherein the main body is formed along a perimeter of the circuit board or the electronic component.
3. The electromagnetic interference suppressing device of claim 1 , wherein the electronic component is coupled to a grounding layer of the uppermost layer of the circuit board through a plurality of bonding points.
4. The electromagnetic interference suppressing device of claim 1 , wherein the plurality of ground pads is formed on the uppermost layer and the lowermost layer of the circuit board.
5. The electromagnetic interference suppressing device of claim 4 , wherein the plurality of ground pads are formed with a same amount on the uppermost layer and the lowermost layer of the circuit board respectively.
6. The electromagnetic interference suppressing device of claim 1 , wherein the plurality of grounding units is arranged in a symmetrical manner.
7. The electromagnetic interference suppressing device of claim 1 , wherein the circuit board is a multi-layer printed circuit board.
8. The electromagnetic interference suppressing device of claim 1 , wherein the electronic component is a high-speed signal connector.
9. The electromagnetic interference suppressing device of claim 1 , wherein the plurality of signal guiding units, the main body, and the plurality of grounding units are formed as a monolithic structure.
10. The electromagnetic interference suppressing device of claim 1 , wherein the plurality of signal guiding units, the main body, and the plurality of grounding units are made of electrically conductive material.
11. The electromagnetic interference suppressing device of claim 1 , further comprising a fixing unit for fixing the electromagnetic interference suppressing device onto the circuit board or the electronic component.
12. An electronic device, comprising:
a circuit board for installing an electronic component; and
an electromagnetic interference suppressing device, comprising:
a plurality of signal guiding units coupled to a metal housing of the electronic component for receiving a plurality of signals transmitted from the metal housing;
a plurality of grounding units coupled to a plurality of ground pads of the circuit board for transmitting the plurality of signals to the plurality of ground pads; and
a main body coupled to the plurality of signal guiding units and the plurality of grounding units for transmitting the plurality of signals between the plurality of signal guiding units and the plurality of grounding units so as to implement a return path;
wherein power of electromagnetic interference corresponding to the plurality of signals is substantially less than 34 dB-microvolts per meter when frequency bands of the plurality of signals are between 30 megahertz and 224 megahertz and the power of electromagnetic interference corresponding to the plurality of signals is substantially less than 41 dB-microvolts per meter when the frequency bands of the plurality of signals are between 224 megahertz and 1 gigahertz.
13. The electronic device of claim 12 , wherein the circuit board is a multi layer printed circuit board.
14. The electronic device of claim 12 , wherein the electronic component is a high-speed signal connector.
15. The electronic device of claim 12 , wherein the main body is formed along a perimeter of the circuit board or the electronic component.
16. The electronic device of claim 12 , wherein the electronic component is coupled to a grounding layer of the uppermost layer of the circuit board through a plurality of bonding points.
17. The electronic device of claim 12 , wherein the plurality of ground pads is formed on the uppermost layer and the lowermost layer of the circuit board.
18. The electronic device of claim 17 , wherein the plurality of ground pads are formed with a same amount on the uppermost layer and the lowermost layer of the circuit board respectively.
19. The electronic device of claim 12 , wherein the plurality of grounding units is arranged in a symmetrical manner.
20. The electronic device of claim 12 , wherein the plurality of signal guiding units, the main body, and the plurality of grounding units are formed as a monolithic structure.
21. The electronic device of claim 12 , wherein the plurality of signal guiding units, the main body, and the plurality of grounding units are made of electrically conductive material.
22. The electronic device of claim 12 , further comprising a fixing unit for fixing the electromagnetic interference suppressing device onto the circuit board or the electronic component.