Method for forming fine pattern in semiconductor device

1. A method for forming a contact hole of a semiconductor device, the method comprising:

forming a mask layer over a target etching layer;

forming a photoresist film pattern over the mask layer;

forming a plurality of spacers on sidewalls of the photoresist film pattern, each spacer having a ring shape;

removing the photoresist film pattern;

etching the mask layer using the spacer as an etch mask to form a mask pattern; and

etching the target etching layer using the mask pattern as an etch mask to form a target contact hole,

wherein adjacent spacers contact each other in a first direction and a second direction perpendicular to the first direction, and the adjacent spacers are separated from each other by a designated distance in a diagonal direction between the first direction and the second direction.

2. The method of claim 1 , wherein the photoresist film pattern has a pillar shape.

3. The method of claim 2 , wherein the photoresist film pattern is formed through a single patterning process or a double exposure process.

4. The method of claim 2 , wherein the forming the photoresist film pattern comprises:

forming a photoresist film over the mask layer;

etching the photoresist film to form a first pillar pattern, the first pillar pattern having a critical dimension (CD) larger than a target CD; and

trimming the first pillar pattern to reduce the CD of the first pillar pattern to the target CD.

5. The method of claim 4 , wherein the first pillar pattern is formed through a single patterning process or a double exposure process.

6. The method of claim 1 , wherein the target contact hole includes a first contact hole region within the spacer and a second contact hole region between spacers.

7. The method of claim 1 , wherein the spacer is formed with an atomic layer deposition (ALD) process.

8. The method of claim 7 , wherein the ALD process is performed at a low temperature ranging from 0 to 200° C.

9. The method of claim 1 , wherein the spacers comprise a nitride film, an oxide film or a combination thereof.

10. The method of claim 1 , wherein the mask layer is formed with a stacking structure of an amorphous carbon layer and a silicon oxynitride film.

11. The method of claim 1 , wherein the designated distance between spacers is substantially uniform.

12. The method of claim 1 , further comprising forming a bottom anti reflection coating (BARC) under the photoresist film pattern.

13. A method for forming a contact hole of a semiconductor device, the method comprising:

providing a substrate having a mask layer over a target etching layer;

forming a photoresist pattern over the mask layer, the photoresist pattern having a first width;

trimming the photoresist pattern to have a second width that is smaller than the first width;

forming a plurality of spacers on sidewalls of the photoresist pattern having the second width, each spacer having a ring shape;

removing the photoresist film pattern;

etching the mask layer using the spacer as an etch mask to form a mask pattern; and

etching the target etching layer using the mask pattern as an etch mask to form a target contact hole,

wherein adjacent spacers contact each other in a first direction and a second direction perpendicular to the first direction, and the adjacent spacers are separated from each other by a designated distance in a diagonal direction between the first direction and the second direction.

14. The method of claim 13 , wherein the plurality of spacers are formed around the photoresist pattern having the second width.

15. The method of claim 13 , wherein the target contact hole includes a first contact hole region in an inner portion of the ring shape of the spacer and a second contact hole region between spacers.

16. A method for forming a contact hole of a semiconductor device, the method comprising:

forming a mask layer over a target etching layer;

forming a photoresist film pattern over the mask layer;

forming a plurality of spacers on sidewalls of the photoresist film pattern, each spacer having a ring shape;

removing the photoresist film pattern;

etching the mask layer using the spacer as an etch mask to form a mask pattern; and

etching the target etching layer using the mask pattern as an etch mask to form a target contact hole,

wherein adjacent spacers contact each other in a first direction and a second direction perpendicular to the first direction, and the adjacent spacers are separated from each other by a designated distance in a third direction between the first direction and the second direction.

17. A method for forming a contact hole of a semiconductor device, the method comprising:

providing a substrate having a mask layer over a target etching layer;

forming a photoresist pattern over the mask layer, the photoresist pattern having a first width;

trimming the photoresist pattern to have a second width that is smaller than the first width;

forming a plurality of spacers on sidewalls of the photoresist pattern having the second width, each spacer having a ring shape;

removing the photoresist film pattern;

etching the mask layer using the spacer as an etch mask to form a mask pattern; and

etching the target etching layer using the mask pattern as an etch mask to form a target contact hole,

wherein adjacent spacers contact each other in a first direction and a second direction perpendicular to the first direction, and the adjacent spacers are separated from each other by a designated distance in a third direction between the first direction and the second direction.