Hermetically-sealed packages for electronic components having reduced unused areas
Hermetically-sealed packages for electronic components, e.g., OLEDs, are provided. The packages have a first glass substrate ( 12 ), a second glass substrate ( 16 ), and a wall ( 14 ) that separates the first and second substrates ( 12,16 ) and hermetically seals the electronic component ( 18 ) between the substrates ( 12,16 ). The package has a reduced outer unused area characterized by distances D first ( 32 a ) and D second ( 32 b ) at least one of which, and, in certain embodiments, both of which are less than 200 microns, e.g., one or both of D first ( 32 a ) and D second ( 32 b ) is approximately 100 microns. The reduction in unused area can be used to increase viewing area, improve electrical lead design, and/or increase package strength through the use of a wider sintered frit wall ( 14 ).
1. A method of making a glass package comprising:
depositing a frit-containing paste on a major surface of a first glass substrate in a predetermined pattern;
sintering the frit-containing paste to form a sintered frit;
placing the first glass substrate on a second glass substrate such that the sintered frit is positioned between the first and second glass substrates;
traversing a laser beam over the sintered frit to melt the frit, thereby bonding the first glass substrate to the second glass substrate to form a glass package comprising the first glass substrate, the second glass substrate, and a wall that comprises the sintered glass frit and separates the first and second substrates;
scoring and breaking the glass package to a predetermined size wherein:
(a) the glass package has first and second sides:
(b) the wall has first and second sides that are substantially parallel to the first and second sides of the package, respectively;
(c) the first side of the glass package and the first side of the wall are separated by a distance D first ;
(d) the second side of the package and the second side of the wall are separated by a distance D second ; and
trimming the glass package such that at least one of D first and D second is less than or equal to 200 microns.
2. The method according to claim 1 , wherein the step of trimming comprises grinding a scored and broken glass edge to form at least one of the first or second sides.
3. The method according to claim 2 , further comprising flooding the scored and broken glass edge with a cooling medium while performing the grinding step.
4. The method according to claim 2 , further comprising filling a space between the first and second glass substrates and the wall with a resin prior to the grinding.
5. The method according to claim 1 , wherein an electronic component is hermetically sealed between the first and second glass substrates.
6. The method according to claim 5 , wherein the electronic component is an organic light emitting diode.
7. The method according to claim 1 , wherein at least one of D first and D second is less than or equal to 100 microns.
8. The method according to claim 1 , further comprising grinding the sintered frit prior to the step of placing.
9. A method of making a glass package comprising:
depositing a frit-containing paste on a major surface of a first glass substrate in a predetermined pattern;
sintering the frit-containing paste to form a sintered frit;
placing the first glass substrate on a second glass substrate such that the sintered frit is positioned between the first and second glass substrates;
traversing a laser beam over the sintered frit to melt the frit, thereby bonding the first glass substrate to the second glass substrate to form a glass package comprising the first glass substrate, the second glass substrate, and a wall that comprises the sintered glass frit and separates the first and second substrates;
scoring and breaking the glass package to a predetermined size wherein:
(a) the glass package has first and second sides:
(b) the wall has first and second sides that are substantially parallel to the first and second sides of the package, respectively;
(c) the first side of the glass package and the first side of the wall are separated by a distance D first ;
(d) the second side of the package and the second side of the wall are separated by a distance D second ; and
grinding a scored and broken glass edge to form at least one of the first or second sides the glass package such that at least one of D first and D second is less than or equal to 200 microns.
10. The method according to claim 9 , further comprising flooding the scored and broken glass edge with a cooling medium while performing the grinding step.
11. The method according to claim 9 further comprising filling a space between the first and second glass substrates and the wall with a resin prior to the grinding.
12. The method according to claim 9 , wherein an electronic component is hermetically sealed between the first and second glass substrates.
13. The method according to claim 12 , wherein the electronic component is an organic light emitting diode.
14. The method according to claim 9 , wherein at least one of D first and D second is less than or equal to 100 microns.
15. The method according to claim 9 , further comprising grinding the sintered frit prior to the step of placing.