Stacking method and stacking carrier
A stacking carrier and a stacking method are provided. The stacking method is used between a wafer and a stacking carrier having the same shape. The stacking method includes the following steps. Firstly, an adhesive layer is coated on a surface of the carrier. Then, the adhesive layer corresponding to an edge of the carrier is partially removed, thereby defining at least one adhesive layer indentation. Afterwards, the wafer is stacked on the carrier through the adhesive layer having the adhesive layer indentation.
1. A stacking method for use between a wafer and a carrier having the same shape, the stacking method comprising steps of:
coating an adhesive layer on a surface of the carrier, the adhesive layer being directly contacted with the carrier;
partially removing the adhesive layer corresponding to an edge of the carrier, thereby defining at least one adhesive layer indentation in the adhesive layer at the edge of the carrier; and
stacking the wafer on the carrier through the adhesive layer having the adhesive layer indentation.
2. The stacking method according to claim 1 wherein the adhesive layer is formed by spin-coating a photosensing material on a surface of the carrier, and the at least one adhesive layer indentation is defined by performing a photolithography and etching procedure to partially remove the adhesive layer corresponding to the edge of the carrier.
3. The stacking method according to claim 1 wherein the at least one adhesive layer indentation includes a plurality of circular indentations, which are separated from each other.
4. The stacking method according to claim 1 wherein the at least one adhesive layer indentation includes a plurality of saw-toothed, which are in communication with each other to collectively form an indentation band.
5. A stacking carrier applied to a wafer having the same shape, the stacking carrier comprising:
a carrier body;
an adhesive layer overlying the carrier body for providing adhesion required to stack the wafer on the carrier body, the adhesive layer being directly contacted with the carrier; and
at least one adhesive layer indentation formed in the adhesive layer at an edge of the carrier body.
6. The stacking carrier according to claim 5 wherein the carrier body is a glass substrate or a semiconductor substrate, and the wafer is a semiconductor wafer.
7. The stacking carrier according to claim 5 wherein a thicker hump is formed at an edge of the carrier body.
8. The stacking carrier according to claim 5 wherein the at least one adhesive layer indentation includes a plurality of circular indentations, which are separated from each other.
9. The stacking carrier according to claim 5 wherein the at least one adhesive layer indentation includes a plurality of saw-toothed, which are in communication with each other to collectively form an indentation band.
10. The stacking carrier according to claim 5 wherein the adhesive layer is formed by spin-coating a photosensing material on a surface of the carrier body.