Cleaning agent for electronic materials
Provided is a cleaning agent for electronic materials, which enables very efficient advanced cleaning such that yield in the production of the electronic materials is improved and cleaning in a short period of time becomes possible, the cleaning agent having excellent cleaning power for fine-grained particles and organic matter and being able to reduce metallic contamination on the substrate. The cleaning agent for electronic materials comprises sulfamic acid (A), an anionic surfactant having at least one sulfonic acid group or a salt thereof in the molecule (B), a chelating agent (C), and water, wherein the pH at 25 C is preferably not more than 3.0 and the (B) is preferably a polymeric anionic surfactant (B1) having a weight average molecular weight of 1,000 to 2,000,000.
1. A cleaning agent for electronic materials, consisting of:
sulfamic acid (A),
an anionic surfactant having at least one sulfonic acid group or a salt thereof in the molecule (B),
a chelating agent (C),
optionally, a hydrophilic solvent (D),
optionally, a nonionic surfactant (E), and
water as essential components,
wherein pH at 25° C. is not more than 3.0,
wherein a content of the sulfamic acid (A) is 5 to 90 weight %, a content of the anionic surfactant (B) is 0.1 to 50 weight %, and a content of the chelating agent (C) is 0.1 to 50 weight %, a content of the nonionic surfactant (E) is 0 to 10 weight %, based on a total weight of active ingredients of the cleaning agent.
2. The cleaning agent for electronic materials according to claim 1 , wherein a weight ratio of (B) relative to (C), [(B)/(C)], is preferably 0.1 to 7.
3. The cleaning agent for electronic materials according to claim 1 , wherein the (B) is a polymeric anionic surfactant (B1) having a weight average molecular weight of 1,000 to 2,000,000.
4. The cleaning agent for electronic materials according to claim 3 , wherein the (B1) is at least one selected from a group consisting of polystyrenesulfonic acid, poly {2-(meth)acryloylamino-2,2-dimethylethanesulfonic acid}, 2-(meth)acryloylamino-2,2-dimethylethanesulfonic acid/(meth)acrylic acid copolymer, naphthalenesulfonic acid-formaldehyde condensate, and salts thereof.
5. The cleaning agent for electronic materials according to claim 1 , wherein the (C) is at least one selected from a group consisting of aminopolycarboxylic acid, hydroxycarboxylic acid, phosphonic acid, condensed phosphoric acid, and salts thereof.
6. The cleaning agent for electronic materials according to claim 1 , further comprising a nonionic surfactant (E).
7. The cleaning agent for electronic materials according to claim 1 , wherein the electronic materials are substrates after being polished with silica, alumina, or diamond used as an abrasive.
8. The cleaning agent for electronic materials according to claim 1 , wherein the electronic material is a glass substrate for magnetic disk, glass substrate for flat panel display, glass substrate for photomask, optical lens, glass substrate for thin-film photovoltaic cell, or semiconductor substrate.
9. A method for producing electronic materials, comprising a step of cleaning the electronic materials by using the cleaning agent according to claim 1 .
10. The cleaning agent for electronic materials according to claim 1 , wherein the cleaning agent for electronic materials, consisting of
the sulfamic acid (A),
the anionic surfactant (B),
the chelating agent (C),
optionally, the hydrophilic solvent (D),
the nonionic surfactant (E), and
water
wherein the content of the nonionic surfactant (E) is 0.1 to 10 weight %, based on the total weight of active ingredients of the cleaning agent.
11. The cleaning agent for electronic materials according to claim 10 , wherein the cleaning agent for electronic materials, consisting of
the sulfamic acid (A),
the anionic surfactant (B),
the chelating agent (C),
the hydrophilic solvent (D),
the nonionic surfactant (E), and
water.
12. The cleaning agent for electronic materials according to claim 11 , further comprising a hydrophilic solvent (D), wherein a content of the hydrophilic solvent (D) is 1 to 70 weight %, based on a total weight of active ingredients of the cleaning agent.