IP Library › Granted Patent US 8,324,508
Granted Patent B2
US 8,324,508 · App. 12/679,653 · Granted Dec 4, 2012

Composite circuit board

Assignee: Kyocera Corporation
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,324,508
App. No.
12/679,653
Granted
Dec 4, 2012
Kind
B2
Abstract

A composite circuit board according to an embodiment of the invention includes a first circuit board having a first conductive line and a second conductive line which is longer in length than the first conductive line, and a second circuit board having a third conductive line which is electrically connected to the first conductive line and a fourth conductive line which is electrically connected to the second conductive line and is shorter in length than the third conductive line.

Claims (27)

1. A composite circuit board, comprising:

a first circuit board comprising

a first dielectric substrate,

a first conductive line which comprises a first internal-layer conductive line inside the first dielectric substrate and first through conductor located from an end of the first internal-layer conductive line to a first main surface of the first dielectric substrate, and

a second conductive line which comprises a second internal-layer conductive line inside the first dielectric substrate so as to align partly with the first internal-layer conductive line and a second through conductor located from an end of the second internal-layer conductive line to the first main surface; and

a second circuit board comprising

a second dielectric substrate,

a third conductive line which is electrically connected to the first conductive line, and

a fourth conductive line which is electrically connected to the second conductive line and is shorter than the third conductive line,

wherein the second internal-layer conductive line is longer than the first internal-layer conductive line, the second conductive line is longer than the first conductive line, and the third conductive line and the fourth conductive line are located on a same main surface of the second dielectric substrate.

2. The composite circuit board of claim 1 , wherein

the first conductive line further comprises a first end which is located on the first main surface and is connected to the first through conductor,

the second conductive line further comprises a second end which is located on the first main surface and is connected to the second through conductor,

the third conductive line further comprises a third end which is located on a second main surface, one of main surfaces of the second circuit board, facing to the first main surface, and is electrically connected to the first end, and

the fourth conductive line further comprises a fourth end which is located on the second main surface and is electrically connected to the second end.

3. The composite circuit board of claim 2 , further comprising:

a first conductive member configured to connect the first end and the third end; and

a second conductive member configured to connect the second end and the fourth end.

4. The composite circuit board of claim 2 , wherein the first to fourth ends are each a circular connection pad.

5. The composite circuit board of claim 1 , wherein the first internal-layer conductive line and the second internal-layer conductive line are so arranged that mutual aligned regions thereof are overlapped when viewed perspectively from a top face of the first dielectric substrate.

6. The composite circuit board of claim 1 , wherein the first internal-layer conductive line and the second internal-layer conductive line are each conductive linearly shaped.

7. The composite circuit board of claim 1 , wherein the fourth conductive line is conductive linearly shaped, and,

when viewed perspectively from a top face of the first dielectric substrate, the fourth conductive line, the first internal-layer conductive line and the second internal-layer conductive line are located in a same straight line.

8. The composite circuit board of claim 1 ,

wherein the third conductive line comprises

a parallel line portion in parallel with the fourth conductive line, and

an extension portion which is configured to make the third conductive line longer than the fourth conductive line.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 23, 2010
From: MAETANI, MARAKI
To: KYOCERA CORPORATION
Reel/Frame 024125/0881 →
Priority Claims (1)
JP 2008-088851 · Mar 28, 2008 · national
Continuity (1)
Related Publication 20100206625A1 · Aug 19, 2010