Integrated circuit package having a plurality of spaced apart pad portions
An integrated circuit package having a selectively etched leadframe strip defining a die attach pad and a plurality of contact pads, at least one side of the die attach pad having a plurality of spaced apart pad portions; a semiconductor die mounted to the die attach pad and wires bonding the semiconductor die to respective ones of the contact pads; a first surface of the leadframe strip, including the semiconductor die and wire bonds, encapsulated in a molding material such that at least one surface of the leadframe strip is exposed, and wherein solder paste is disposed on said contact pads and said at least one side of said die attach pad.
1. An integrated circuit package comprising:
a die attach pad, continuous on one side of said die attach pad and having a plurality of spaced apart pad portions on a second side of the die attach pad opposite said first side;
a plurality of contact pads circumscribing said die attach pad;
a semiconductor die mounted to said die attach pad on said continuous one side;
a plurality of wire bonds connecting said semiconductor die to ones of said contact pads;
a molding material encapsulating said semiconductor die, said wire bonds and at least a surface of each of said die attach pad and said contact pads, such that at least one surface of each of said contact pads and said die attach pad is exposed; and
solder paste disposed on said contact pads and said at least one side of said die attach pad.
2. The integrated circuit package according to claim 1 , wherein said pad portions form an array.
3. The integrated circuit package according to claim 1 wherein ones of said pad portions have a generally square cross-section.
4. An integrated circuit package comprising:
a die attach pad, continuous on one side of said die attach pad and having a plurality of spaced apart pad portions on a second side of the die attach pad opposite said first side;
a plurality of contact pads circumscribing said die attach pad;
a semiconductor die mounted to said die attach pad on said continuous one side;
a plurality of wire bonds connecting said semiconductor die to ones of said contact pads;
a molding material encapsulating said semiconductor die, said wire bonds and at least a surface of each of said die attach pad and said contact pads, such that at least one surface of each of said contact pads and said die attach pad is exposed; and
solder paste disposed on said contact pads and said at least one side of said die attach pad,
wherein ones of said pad portions have a generally circular cross-section.
5. An integrated circuit package comprising:
a die attach pad, continuous on one side of said die attach pad and having a plurality of spaced apart pad portions on a second side of the die attach pad opposite said first side;
a plurality of contact pads circumscribing said die attach pad;
a semiconductor die mounted to said die attach pad on said continuous one side;
a plurality of wire bonds connecting said semiconductor die to ones of said contact pads;
a molding material encapsulating said semiconductor die, said wire bonds and at least a surface of each of said die attach pad and said contact pads, such that at least one surface of each of said contact pads and said die attach pad is exposed; and
solder paste disposed on said contact pads and said at least one side of said die attach pad,
wherein said pad portions form a diamond pattern such that sides of said pad portions form an oblique angle with sides of said molding material.
6. The integrated circuit package according to claim 1 , wherein said pad portions form an array of similarly sized pad portions.
7. A leadframe strip comprising a plurality of units, each of said units comprising:
a die attach pad, continuous on one side of said die attach pad, said continuous one side configured to have a semiconductor die mounted thereon, and having a plurality of spaced apart pad portions on a second side of the die attach pad opposite said first side; and
a plurality of contact pads circumscribing said die attach pad; and
solder paste disposed on said contact pads and said at least one side of said die attach pad.
8. The leadframe strip according to claim 7 , wherein ones of said pad portions have a generally square cross-section.
9. The leadframe strip according to claim 7 , wherein ones of said pad portions have a generally circular cross-section.
10. The leadframe strip according to claim 9 , wherein said pad portions form a diamond pattern such that side of ones of said pad portions form an oblique angle with sides of said die attach pad at said die attach pad's said continuous one side.
11. The leadframe strip according to claim 10 , wherein said pad portions form an array of similarly sized pad portions.
12. The leadframe strip according to claim 7 , wherein ones of said plurality of pad portions have a generally square cross-section.
13. The leadframe strip according to claim 7 , wherein ones of said plurality of pad portions have a generally circular cross-section.
14. The leadframe according to claim 12 , wherein said pad portions are in a diamond pattern such that sides of said pad portions are at an oblique angle with sides of said die attach pad at said die attach pad's said continuous one side.
15. The integrated circuit package according to claim 1 , wherein said pad portions form an array.