Connection method and substrate
A connection method includes the step of connecting, using a line on a dielectric element, two points through which a signal flows, the two points having different heights and the widths of the line at the positions of the two points having been adjusted on the basis of the thickness of the dielectric element.
1. A substrate, comprising:
a dielectric element mounted on the substrate, the dielectric element including steps;
an electric part mounted on the substrate;
a first line through which a signal flows connecting two points on the dielectric element, the two points having different heights and a width of the first line at positions of the two points being based on a thickness of the dielectric element, a higher point of the two points being a point on a second line of the electronic part mounted on the substrate, a lower point of the two points is a point on a third line of the substrate, the two points having different heights are connected by the first line disposed on the steps, and the width of the first line is constant on each of the steps.
2. The substrate according to claim 1 , wherein the dielectric element includes five steps.
3. The substrate according to claim 1 , wherein the width of the first line on a bottom step is wider than a width of the third line.
4. A connection method comprising:
connecting, using a first line on a dielectric element, two points through which a signal flows, the two points having different heights and the widths of the first line at the positions of the two points based on a thickness of the dielectric element, a higher point of the two points being a point on a second line of an electronic part mounted on a substrate, a lower point of the two points being a point on a third line of the substrate, and steps at which the thickness of the dielectric element decreases toward a connection part with the first line of the substrate are formed in the end portion of the electronic part composed of a dielectric material, the two points having different heights are connected by the first line disposed on the steps, and the width of the first line is constant on each of the steps.
5. The method according to claim 4 , wherein the dielectric element includes five steps.
6. The method according to claim 4 , wherein the width of the first line on a bottom step is wider than a width of the third line.