Pressure-sensitive adhesive sheet, method of processing adherend with the pressure-sensitive adhesive sheet, and apparatus for stripping pressure-sensitive adhesive sheet
To provide a pressure-sensitive adhesive sheet which protects a ground, thin, fragile adherend from “warping” and which can be removed from the fragile adherend after the completion of backgrinding without damaging and contaminating the fragile adherend. The pressure-sensitive adhesive sheet 5 includes a base layer A, a pressure-sensitive adhesive layer A, a base layer B, and a pressure-sensitive adhesive layer B arranged in this order, in which: the base layer A has a product of its Young's modulus at 25° C. and its thickness of 1.0×10 5 to 4.0×10 5 N/m and a product of its Young's modulus at 80° C. and its thickness of 2.8×10 5 N/m or less; the pressure-sensitive adhesive layer A has a shear modulus at 80° C. of 0.2 MPa or less; the base layer B has a product of its Young's modulus at 25° C. and its thickness of smaller than that of the base layer A and has, upon 80° C. heating, a shrink percentage in MD and a shrink percentage in TD of each 20% or more; and the pressure-sensitive adhesive layer B has a Young's modulus at 80° C. of 10 MPa or more and an adhesive strength to a silicon wafer (180-degree peel at a tensile speed of 300 mm/min) of 0.2 N/10 mm or less.
1. A pressure-sensitive adhesive sheet comprising a base layer A, a pressure-sensitive adhesive layer A, a base layer B, and a pressure-sensitive adhesive layer B as arranged in this order,
wherein the base layer A is a base layer having such a Young's modulus at 25° C., a Young's modulus at 80° C., and a thickness that the product of the Young's modulus at 25° C. and the thickness is 1.0×10 5 to 4.0×10 5 N/m and the product of the Young's modulus at 80° C. and the thickness is 2.8×10 5 N/m or less;
wherein the pressure-sensitive adhesive layer A is a pressure-sensitive adhesive layer having a shear modulus at 80° C. of 0.2 MPa or less;
wherein the base layer B has such a thickness and a Young's modulus at 25° C. that the product of the Young's modulus at 25° C. and the thickness is smaller than the product, of the base layer A, of the Young's modulus at 25° C. and the thickness, and wherein the base layer B is a heat-shrinkable base layer having, upon 80° C. heating, a shrink percentage in a main shrinkage direction of 20% or more and a shrink percentage in a direction perpendicular to the main shrinkage direction of 20% or more; and
wherein the pressure-sensitive adhesive layer B is a pressure-sensitive adhesive layer having a Young's modulus at 80° C. of 10 MPa or more and having an adhesive strength to a silicon wafer (180-degree peel at a tensile speed of 300 mm/min) of 0.2 N/10 mm or less.
2. The pressure-sensitive adhesive sheet according to claim 1 , wherein the base layer A has, upon heating to 80° C., a shrink percentage of 1% or less and an expansion coefficient of 1% or less.
3. The pressure-sensitive adhesive sheet according to claim 1 , wherein the pressure-sensitive adhesive layer B is a pressure-sensitive adhesive layer curable by the action of an active energy ray.
4. The pressure-sensitive adhesive sheet according to claim 1 , wherein the pressure-sensitive adhesive layer B comprises an acrylic polymer containing a (meth)acrylate in its side chain; a crosslinking agent; and an initiator for active-energy-ray-induced polymerization.
5. A method of processing an adherend, the method comprising the steps of affixing the pressure-sensitive adhesive sheet as defined in claim 1 to an adherend; subjecting the affixed adherend to a predetermined processing; heating the pressure-sensitive adhesive sheet after the processing to thereby allow the pressure-sensitive adhesive sheet to bend so that the surface of the base layer A is bowed inward to give a lifting from the adherend; and stripping the pressure-sensitive adhesive sheet from the adherend.
6. The method of processing an adherend according to claim 5 , wherein the pressure-sensitive adhesive sheet includes an active-energy-ray-curable pressure-sensitive adhesive layer as the pressure-sensitive adhesive layer B, and wherein the method comprises the steps of affixing the pressure-sensitive adhesive sheet to an adherend, subjecting the affixed adherend to a predetermined processing, applying an active energy ray to the pressure-sensitive adhesive sheet to cure the pressure-sensitive adhesive layer B, and carrying out heating to allow the pressure-sensitive adhesive sheet to bend so that the surface of the base layer A is bowed inward, to thereby form a lifting from the adherend.
7. The method of processing an adherend according to claim 5 , wherein the step of stripping the pressure-sensitive adhesive sheet is performed by affixing a stripping tape to a periphery of the surface of the base layer A of the bent pressure-sensitive adhesive sheet; and pulling the stripping tape in a direction opposite to the adherend.
8. The pressure-sensitive adhesive sheet according to claim 2 , wherein the pressure-sensitive adhesive layer B is a pressure-sensitive adhesive layer curable by the action of an active energy ray.
9. The pressure-sensitive adhesive sheet according to claim 2 , wherein the pressure-sensitive adhesive layer B comprises an acrylic polymer containing a (meth)acrylate in its side chain; a crosslinking agent; and an initiator for active-energy-ray-induced polymerization.
10. The pressure-sensitive adhesive sheet according to claim 3 , wherein the pressure-sensitive adhesive layer B comprises an acrylic polymer containing a (meth)acrylate in its side chain; a crosslinking agent; and an initiator for active-energy-ray-induced polymerization.
11. A method of processing an adherend, the method comprising the steps of affixing the pressure-sensitive adhesive sheet as defined in claim 2 to an adherend; subjecting the affixed adherend to a predetermined processing; heating the pressure-sensitive adhesive sheet after the processing to thereby allow the pressure-sensitive adhesive sheet to bend so that the surface of the base layer A is bowed inward to give a lifting from the adherend; and stripping the pressure-sensitive adhesive sheet from the adherend.
12. A method of processing an adherend, the method comprising the steps of affixing the pressure-sensitive adhesive sheet as defined in claim 3 to an adherend; subjecting the affixed adherend to a predetermined processing; heating the pressure-sensitive adhesive sheet after the processing to thereby allow the pressure-sensitive adhesive sheet to bend so that the surface of the base layer A is bowed inward to give a lifting from the adherend; and stripping the pressure-sensitive adhesive sheet from the adherend.
13. A method of processing an adherend, the method comprising the steps of affixing the pressure-sensitive adhesive sheet as defined in claim 4 to an adherend; subjecting the affixed adherend to a predetermined processing; heating the pressure-sensitive adhesive sheet after the processing to thereby allow the pressure-sensitive adhesive sheet to bend so that the surface of the base layer A is bowed inward to give a lifting from the adherend; and stripping the pressure-sensitive adhesive sheet from the adherend.
14. The method of processing an adherend according to claim 11 , wherein the pressure-sensitive adhesive sheet includes an active-energy-ray-curable pressure-sensitive adhesive layer as the pressure-sensitive adhesive layer B, and wherein the method comprises the steps of affixing the pressure-sensitive adhesive sheet to an adherend, subjecting the affixed adherend to a predetermined processing, applying an active energy ray to the pressure-sensitive adhesive sheet to cure the pressure-sensitive adhesive layer B, and carrying out heating to allow the pressure-sensitive adhesive sheet to bend so that the surface of the base layer A is bowed inward, to thereby form a lifting from the adherend.
15. The method of processing an adherend according to claim 12 , wherein the pressure-sensitive adhesive sheet includes an active-energy-ray-curable pressure-sensitive adhesive layer as the pressure-sensitive adhesive layer B, and wherein the method comprises the steps of affixing the pressure-sensitive adhesive sheet to an adherend, subjecting the affixed adherend to a predetermined processing, applying an active energy ray to the pressure-sensitive adhesive sheet to cure the pressure-sensitive adhesive layer B, and carrying out heating to allow the pressure-sensitive adhesive sheet to bend so that the surface of the base layer A is bowed inward, to thereby form a lifting from the adherend.
16. The method of processing an adherend according to claim 13 , wherein the pressure-sensitive adhesive sheet includes an active-energy-ray-curable pressure-sensitive adhesive layer as the pressure-sensitive adhesive layer B, and wherein the method comprises the steps of affixing the pressure-sensitive adhesive sheet to an adherend, subjecting the affixed adherend to a predetermined processing, applying an active energy ray to the pressure-sensitive adhesive sheet to cure the pressure-sensitive adhesive layer B, and carrying out heating to allow the pressure-sensitive adhesive sheet to bend so that the surface of the base layer A is bowed inward, to thereby form a lifting from the adherend.
17. The method of processing an adherend according to claim 6 , wherein the step of stripping the pressure-sensitive adhesive sheet is performed by affixing a stripping tape to a periphery of the surface of the base layer A of the bent pressure-sensitive adhesive sheet; and pulling the stripping tape in a direction opposite to the adherend.