Molded leadframe substrate semiconductor package
A process for forming semiconductor packages includes partially etching a leadframe matrix, encapsulating it with mold compound, placing a semiconductor die in a leadframe unit and singulating the leadframe matrix. A system for forming semiconductor packages includes means for partially etching a leadframe matrix, means for encapsulating it with mold compound, means for placing a semiconductor die in a leadframe unit and means for singulating the leadframe matrix.
1. A system for forming singulated semiconductor devices comprising:
a. a top mold comprising an injector for injecting a mold compound in a liquid state; and
b. a bottom mold configured to hold a leadframe matrix to receive the mold compound in a liquid state thereby forming a molded leadframe matrix;
c. a pick and place mechanism for placing semiconductor die in individual leadframe units; and
d. at least one cutting element for singulating the molded leadframe matrix thereby forming singulated semiconductor devices.
2. The system for forming singulated semiconductor devices according to claim 1 wherein the injector comprises a film gate.
3. The system for forming singulated semiconductor devices according to claim 1 wherein the injector comprises a pincer gate.
4. The system for forming singulated semiconductor devices according to claim 1 further comprising a tape carrier for carrying the leadframe units.
5. The system for forming singulated semiconductor devices according to claim 1 wherein the at least one cutting element comprises a saw.
6. The system for forming singulated semiconductor devices according to claim 1 wherein the at least one cutting element comprises a punch.
7. The system for forming singulated semiconductor devices according to claim 1 wherein the injector comprises a pincer gate.
8. The system for forming singulated semiconductor devices according to claim 1 wherein the injector comprises a film gate.
9. The system for forming singulated semiconductor devices according to claim 1 further comprising a vacuum pump output.