Process for preparing a solar cell

1. A process for preparing a solar cell comprising a support, a layer of cadmium sulfide (CdS), a layer of cadmium telluride (CdTe), a layer of a transparent conductive oxide (TCO), a conductive metallic layer and optionally a layer of buffer material, characterized in that the CdS layer and the CdTe layer are deposited by means of a pulsed plasma deposition (PPD) method.

2. The process according to claim 1 , comprising the steps of:

a) depositing, by means of the PPD method, a layer of CdS on a support which is covered by a layer of transparent conductive oxide (TCO);

b) depositing, by means of the PPD method, a layer of CdTe on the layer of CdS;

c) heating the layers of material deposited previously to a temperature from 400 to 650° C. for a time from 1 to 60 minutes, at a pressure from 1×10 −7 to 1×10 −5 mbar;

d) depositing a conductive metallic layer on the CdTe layer.

3. The process according to claim 2 , characterized in that a layer of buffer material is deposited, by means of the PPD method, on the CdTe layer before step d).

4. The process according to claim 1 , comprising the steps of:

a) depositing, by means of the PPD method, a layer of CdTe on a metallic support or on a support covered by a conductive metallic layer;

b) depositing, by means of the PPD method, a layer of CdS on the layer of CdTe;

c) heating the layers of material deposited previously to a temperature from 400 to 650° C. for 1 to 60 minutes, at a pressure from 1×10 −7 to 1×10 −5 mbar;

d) depositing a layer of transparent conductive oxide (TCO) on the CdS layer.

5. The process according to claim 2 , characterized in that it deposits, by means of the PPD method, a layer of buffer material on the support before step a).

6. The process according to claim 2 or 4 , wherein the support is rigid or flexible.

7. The process according to claim 6 , wherein the rigid support is selected from the group constituted by glass, quartz and an inorganic transparent and heat-resistant material.

8. The process according to claim 6 , wherein the flexible support is selected from the group constituted by a metal sheet and a solid organic material.

9. The process according to claim 8 , wherein the solid organic material is selected from the group constituted by polycarbonate (PC), polytetrafluoroethylene (PTFE) and polyethylene terephthalate (PET).

10. The process according to claim 2 or 4 , wherein the deposition of the CdS layer is performed at a temperature from 200 to 550° C., in the presence of a deposition gas which comprises from 0.1 to 30% sulfur hexafluoride (SF 6 ) by volume and 70% to 99.9% argon by volume, at a gas pressure from 1×10 −3 to 1×10 −2 mbar and with an acceleration of the PPD method from 6 to 18 kV.

11. The process according to claim 10 , wherein the temperature is 300° C.

12. The process according to claim 10 , wherein the deposition gas comprises 2% SF 6 by volume and 98% argon by volume.

13. The process according to claim 10 , wherein the gas pressure ranges from 4×10 −3 to 5×10 −3 mbar.

14. The process according to claim 10 , wherein the acceleration of the PPD method is 8 kV.

15. The process according to claim 2 or 4 , wherein the deposition of the CdTe layer is performed at a temperature from 200 to 550° C., in the presence of a deposition gas which comprises 0 to 50% oxygen by volume and 50 to 100% argon by volume, at a gas pressure from 1×10 −3 to 1×10 −2 mbar and with an acceleration of the PPD method from 6 to 18 kV.

16. The process according to claim 15 , wherein the temperature is 400° C.

17. The process according to claim 15 , wherein the deposition gas comprises 10% oxygen by volume and 90% argon by volume.

18. The process according to claim 15 , wherein the gas pressure is 4×10 −3 mbar.

19. The process according to claim 15 , wherein the acceleration of the PPD method is 8 kV.

20. The process according to claim 3 or 5 , wherein the deposition of the layer of buffer material is performed at a temperature from 200 to 550° C., in the presence of a deposition gas which comprises 100% argon by volume, at a gas pressure from 1×10 −3 to 1×10 −2 mbar and with an acceleration of the PPD method from 6 to 18 kV.

21. The process according to claim 20 , wherein the temperature is 300° C.

22. The process according to claim 20 , wherein the gas pressure is 3×10 −3 mbar.

23. The process according to claim 20 , wherein the acceleration of the PPD method is 8 kV.

24. The process according to claim 2 or 4 , wherein the deposited CdS layer has a thickness ranging from 40 to 150 nm.

25. The process according to claim 24 , wherein the thickness of the CdS layer is 80 nm.

26. The process according to claim 2 or 4 , wherein the deposited CdTe layer has a thickness ranging from 0.5 to 15 μm.

27. The process according to claim 26 , wherein the thickness of the CdTe layer is 6 μm.

28. The process according to claim 2 or 4 , wherein the deposition of the CdTe layer is performed with a pressed and unsintered target which comprises 50 to 100% CdTe by weight, 0 to 40% telluride chloride (TeCl 4 ) by weight and 0 to 40% by weight of cadmium chloride (CdCl 2 ).

29. The process according to claim 28 , wherein the target comprises 85% CdTe by weight, 10% TeCl 4 by weight, and 5% CdCl 2 by weight.

30. The process according to claim 2 or 4 , wherein the step of heating the layers of material is performed at a temperature of 500° C. for 15 minutes at a pressure of 1×10 −6 mbar.

31. The process according to claim 1 , wherein the TCO is selected from the group constituted by indium-tin oxide (ITO) and zinc oxide (ZnO).

32. The process according to claim 31 , wherein the TCO is zinc oxide (ZnO).

33. The process according to claim 3 or 5 , wherein the buffer material is selected from the group constituted by antimony telluride (Sb 2 Te 3 ), zinc telluride (ZnTe), antimony (Sb), titanium selenide (TiSe 2 ), copper sulfides (Cu R S) or nickel phosphide (Ni 2 P).

34. The process according to claim 33 , wherein the buffer material is antimony telluride (Sb 2 Te 3 ).