Semiconductor device
View Patent ↗The semiconductor device includes a signal processing circuit, an antenna circuit that is connected to the signal processing circuit, and a storage means that supplies electric power to the signal processing circuit. The signal processing circuit receives and transmits information through the antenna circuit, generates a direct current voltage from signals received by the antenna circuit, and stores the direct current voltage in the storage means. Furthermore, the antenna circuit has an antenna portion that receives signals by an electromagnetic induction method and an antenna portion that receives signals by a microwave method so that signals of frequencies from a wide band can be received. Because signals from a wide band can be received, the environment in which the storage means can be charged is widened.
1. A semiconductor device comprising:
a signal processing circuit;
a first antenna and a second antenna which are electrically connected to the signal processing circuit,
wherein the first antenna and the second antenna are electrically connected to a common antenna terminal and the signal processing circuit is electrically connected to the antenna terminal; and
a storage device for supplying electric power to the signal processing circuit,
wherein the first antenna is configured to receive a signal by an electromagnetic induction method or an electromagnetic coupling method using a coil-shaped conductor;
wherein the second antenna is configured to receive a signal by a microwave method using a conductor formed of a right triangle conductor and a first linear conductor, which are connected to each other, and a second linear conductor that is connected to said common antenna terminal;
wherein the signal processing circuit is configured to receive and transmit information via the first antenna,
wherein the signal processing circuit is configured to receive and transmit information via the second antenna; and
wherein the signal processing circuit is configured to generate a direct current voltage from the signals received by the first antenna and the second antenna and the storage device is charged up by the direct current voltage.
2. A semiconductor device comprising:
a signal processing circuit comprising a power section and a logic section;
a first antenna and a second antenna which are electrically connected to the power section and the logic section,
wherein the first antenna and the second antenna are electrically connected to a common antenna terminal and the signal processing circuit is electrically connected to the antenna terminal;
a storage device for supplying electric power to the signal processing circuit,
wherein the logic section is configured to receive and transmit information via the first antenna,
wherein the logic section is configured to receive and transmit information via the second antenna; and
wherein the power section is configured to generate a direct current voltage from signals received by the first antenna and the second antenna and the storage device is charged up by the direct current voltage,
wherein the first antenna is configured to receive a signal by an electromagnetic induction method or an electromagnetic coupling method using a coil-shaped conductor; and
wherein the second antenna is configured to receive a signal by a microwave method using a conductor formed of a right triangle conductor and a first linear conductor, which are connected to each other, and a second linear conductor that is connected to said common antenna terminal.
3. A semiconductor device comprising:
a signal processing circuit comprising a power section and a logic section;
a first antenna and a second antenna which are electrically connected to the power section and the logic section,
wherein the first antenna and the second antenna are electrically connected to a common antenna terminal and the signal processing circuit is electrically connected to the antenna terminal;
a storage device for supplying electric power to the signal processing circuit,
wherein the logic section is configured to receive and transmit information via the first antenna;
wherein the logic section is configured to receive and transmit information via the second antenna;
wherein the power section generates a direct current voltage from signals received by the first antenna and the second antenna and the storage device is charged up by the direct current voltage;
wherein a frequency of a signal received by the first antenna and a frequency of a signal received by the second antenna are different
wherein the first antenna is configured to receive a signal by an electromagnetic induction method or an electromagnetic coupling method using a coil-shaped conductor; and
wherein the second antenna is configured to receive a signal by a microwave method using a conductor formed of a right triangle conductor and a first linear conductor, which are connected to each other, and a second linear conductor that is connected to said common antenna terminal.
4. The semiconductor device according to claim 1 , wherein the storage device is a secondary battery.
5. The semiconductor device according to claim 2 , wherein the storage device is a secondary battery.
6. The semiconductor device according to claim 3 , wherein the storage device is a secondary battery.
7. The semiconductor device according to claim 1 , wherein the storage device is a capacitor.
8. The semiconductor device according to claim 2 , wherein the storage device is a capacitor.
9. The semiconductor device according to claim 3 , wherein the storage device is a capacitor.