Intelligent patch panel sensor modules having infrared emitters and sensors for detecting patch cords
A communications patching system includes a patch panel having a plurality of connector ports on a side thereof, and a sensor module secured to the patch panel side. The sensor module includes a plurality of pairs of IR emitters and sensors, with each emitter/sensor pair located adjacent to a respective one of the connector ports. Each emitter/sensor pair is configured to detect insertion and removal of a patch cord connector from a respective connector port. The sensor module includes a housing and a printed circuit board (PCB) secured to the housing. The IR emitters and sensors are electrically connected to the PCB, and the PCB includes a processor and memory for controlling the IR emitters and sensors.
1. A communications patching system, comprising:
a patch panel having a plurality of connector ports on a side thereof; and
a sensor module secured to the patch panel side, wherein the sensor module comprises a housing and a plurality of pairs of IR emitters and sensors within the housing, wherein the sensor module is secured to the patch panel such that each emitter/sensor pair is located adjacent to a respective one of the connector ports, wherein each pair is configured to detect insertion and removal of a patch cord connector from a respective connector port, wherein the housing comprises a separate unobscured passageway between each IR emitter and sensor pair and each connector port, and wherein each passageway is configured to block IR light scattering and to block unwanted IR signals and/or reflections from a source external to the patch panel.
2. The patching system of claim 1 , wherein the sensor module comprises a printed circuit board (PCB) secured to the housing, and wherein the IR emitters and sensors are electrically connected to the PCB, and wherein the PCB includes a processor and memory for controlling the IR emitters and sensors.
3. The patching system of claim 2 , wherein the memory contains firmware executable by the processor for controlling operation of the IR emitters and sensors.
4. The patching system of claim 2 , wherein the memory contains firmware executable by the processor for filtering out unwanted IR signals and/or reflections of IR signals from a source external to the patch panel.
5. The patching system of claim 2 , wherein the memory contains firmware executable by the processor for compensating for IR reflections from different patch cord connector surfaces.
6. The patching system of claim 2 , wherein the housing comprises a plurality of walls that surround the IR emitters and sensors and protect the IR emitter and sensors from damage.
7. The patching system of claim 6 , wherein the walls form respective unobstructed passageways between each IR emitter and corresponding sensor.
8. The patching system of claim 6 , wherein the walls are electrically conductive and are grounded to protect the IR emitters and sensors from static electricity.
9. The patching system of claim 1 , wherein the PCB includes one or more conductive elements that protect the IR emitters and sensors from static electricity.
10. The patching system of claim 9 , wherein the one or more conductive elements comprise a conductive ring that extends around a periphery of the PCB.
11. The patching system of claim 1 , wherein the sensor module has an H-shaped configuration.
12. The patching system of claim 9 , wherein the sensor module has open end portions.
13. The patching system of claim 1 , wherein the sensor module has a comb-shaped configuration.
14. The patching system of claim 1 , wherein the connector ports are configured to receive optical patch cord connectors.
15. The patching system of claim 1 , wherein the connector ports are configured to receive electrical patch cord connectors.
16. The patching system of claim 1 , wherein the sensor module comprises a first portion secured to one side of the connector ports and a second portion secured to the opposite side of the connector ports, and wherein the first and second portions are electrically connected together via a jumper cable.
17. The patching system of claim 16 , wherein the first portion includes the IR emitters and the second portion includes the IR sensors.
18. The patching system of claim 16 , wherein the first portion includes the IR sensors and the second portion includes the IR emitters.
19. A communications patching system, comprising:
a patch panel having a plurality of connector ports on a side thereof;
one or more patch cords, each configured to selectively connect respective pairs of patch panel connector ports, wherein each patch cord includes opposite ends with a connector attached thereto, wherein each connector for a respective patch cord includes an IR-reflective label that creates a unique reflective signature when exposed to IR radiation; and
a sensor module secured to the patch panel side, wherein the sensor module comprises a housing, a printed circuit board (PCB) secured to the housing, and a plurality of pairs of IR emitters and sensors electrically connected to the PCB, a processor and memory for controlling the IR emitters and sensors, wherein the sensor module is secured to the patch panel such that each emitter/sensor pair is located adjacent to a respective one of the connector ports, wherein each IR sensor is configured to detect a reflective signature from a patch cord connector and to detect insertion and removal of a patch cord connector from a respective connector port, and wherein the memory contains firmware executable by the processor that parks a connector port in response to detecting an unauthorized reflective signature from a patch cord connector.
20. A patch cord, comprising opposite ends, each with a connector attached thereto, wherein each connector includes an IR-reflective label that creates a unique reflective signature when exposed to IR radiation.
21. A communications patching system, comprising:
a patch panel having a plurality of connector ports on a side thereof; and
a sensor module secured to the patch panel side, wherein the sensor module comprises a housing, a printed circuit board (PCB) secured to the housing, and a plurality of pairs of IR emitters and sensors electrically connected to the PCB,
a processor and memory for controlling the IR emitters and sensors,
wherein the sensor module is secured to the patch panel such that each emitter/sensor pair is located adjacent to a respective one of the connector ports, wherein each emitter/sensor pair is configured to detect insertion and removal of a patch cord connector from a respective connector port, and
wherein the housing comprises a plurality of walls that surround the IR emitters and sensors and protect the IR emitter and sensors from damage, wherein the walls form respective unobstructed passageways between each IR emitter and corresponding sensor.
22. A communications patching system, comprising:
a patch panel having a plurality of connector ports on a side thereof; and
a sensor module secured to the patch panel side, wherein the sensor module comprises a housing, a printed circuit board (PCB) secured to the housing, and a plurality of pairs of IR emitters and sensors electrically connected to the PCB,
a processor and memory for controlling the IR emitters and sensors,
wherein the sensor module is secured to the patch panel such that each emitter/sensor pair is located adjacent to a respective one of the connector ports, wherein each emitter/sensor pair is configured to detect insertion and removal of a patch cord connector from a respective connector port, and
wherein the housing comprises a plurality of walls that surround the IR emitters and sensors and protect the IR emitter and sensors from damage, and wherein the walls are electrically conductive and are grounded to protect the IR emitters and sensors from static electricity.
23. A communications patching system, comprising:
a patch panel having a plurality of connector ports on a side thereof; and
a sensor module secured to the patch panel side, wherein the sensor module comprises a housing, a printed circuit board (PCB) secured to the housing, and a plurality of pairs of IR emitters and sensors electrically connected to the PCB, wherein the PCB includes one or more conductive elements that protect the IR emitters and sensors from static electricity, a processor and memory for controlling the IR emitters and sensors,
wherein the sensor module is secured to the patch panel such that each emitter/sensor pair is located adjacent to a respective one of the connector ports, wherein each emitter/sensor pair is configured to detect insertion and removal of a patch cord connector from a respective connector port.
24. A communications patching system, comprising:
a patch panel having a plurality of connector ports on a side thereof; and
a sensor module secured to the patch panel side, wherein the sensor module comprises a plurality of pairs of IR emitters and sensors, wherein the sensor module is secured to the patch panel such that each emitter/sensor pair is located adjacent to a respective one of the connector ports, and wherein each emitter/sensor pair is configured to detect insertion and removal of a patch cord connector from a respective connector port,
wherein the sensor module comprises a first portion secured to one side of the connector ports and a second portion secured to the opposite side of the connector ports, and wherein the first and second portions are electrically connected together via a jumper cable.